Sony MZ-B10 service manual Waveforms, Lead Layouts

MZ-B10

6-2. Note For Printed Wiring Board And Schematic Diagrams

• Waveforms

Note on Printed Wiring Board:

•X : parts extracted from the component side.

•Y : parts extracted from the conductor side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from
(Side B)	the pattern face are indicated.
Parts face side:	Parts on the parts face side seen from
(Side A)	the parts face are indicated.

•MAIN board is four-layer printed board.

However, the patterns of layers 2 and 3 have not been included in this diagrams.

*Replacement of IC501,IC801 on MAIN board requires a special tool.

• Lead Layouts surface

Lead layout of conventional IC CSP (chip size package)

Note on Schematic Diagram:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•% : indicates tolerance.

•C : panel designation.

Note: The components identified by mark 0 or dotted line with mark 0 are critical for safety.

Replace only with part number specified.

•A : B+ Line.

•Total current is measured with MD installed.

•Power voltage is dc 3 V and fed with regulated dc power supply from DC IN 3 V jack (J601).

•Voltages and waveforms are dc with respect to ground in playback mode.

no mark : PLAYBACK

( ) : REC

∗: Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MΩ ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

J : PLAYBACK

c : DIGITAL IN

F : ANALOG IN

f : RECORD

•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

*Replacement of IC501,IC801 on MAIN board requires a special tool.

1 IC501 9 (RFO)(TP1517)	4 IC601 4 (CLK)	2.5Vp-p	7 IC301 9 (MCLK)
500mV/DIV, 200ns/DIV 1.1Vp-p	5.67∝s		88.6ns	2.7Vp-p
	1V/DIV, 2∝s/DIV
			1V/DIV, 40ns/DIV
2 IC501 rd (TE)(SL501)	5 IC801 2 (OSCO)		8 IC301 8 (BCLK)
	(at the point of R805)		(REC mode)
730mVp-p	44.3ns	1.5Vp-p		2.6Vp-p
			354ns
500mV/DIV, 1ms/DIV	500mV/DIV, 20ns/DIV		1V/DIV, 100ns/DIV
3 IC501 rs (FE)(SL502)	6 IC901 yd (CLK)	2.5Vp-p	9 IC301 q; (LRCK)
			(REC mode)
270mVp-p			22.7∝s	2.4Vp-p
	5.67∝s
200mV/DIV, 1ms/DIV	1V/DIV, 2∝s/DIV		1V/DIV, 10∝s/DIV

36 36