| TABLE OF CONTENTS |
|
1. | SERVICING NOTES | 3 |
2. | GENERAL | 4 |
3. | DISASSEMBLY | 5 |
4. | TEST MODE | 11 |
5. | ELECTRICAL ADJUSTMENTS | 18 |
6.DIAGRAMS
23 | ||
| ||
| AUDIO Section | 25 |
| ||
| POWER SUPPLY Section | 27 |
Printed Wiring Board | 30 | |
Schematic Diagram | 33 | |
46 | ||
7. | EXPLODED VIEWS | 53 |
8. | ELECTRICAL PARTS LIST | 57 |
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.
•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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