Sony MZ-R91 service manual Printed Wiring Board, Semiconductor Location, Jew

MZ-R90/R91

• Semiconductor

Location

Ref. No.	Location
D301	B-10
D302	B-9
D303	C-4
D304	B-10
D501	G-10
D600	F-6
D601	F-9
D602	G-6
D603	H-9
D801	E-12
D802	F-12
D803	D-11
D804	F-11
D901	D-7
D902	C-9
D903	E-9
D905	C-11
D906	C-11
D907	D-11
IC301	C-12
IC302	C-13
IC303	B-11
IC304	B-4
IC305	D-13
IC501	F-10
IC502	G-12
IC504	E-11
IC505	E-12
IC601	E-12
IC602	H-9
IC603	G-9
IC604	F-12
IC605	G-9
IC801	H-11
IC802	H-10
IC803	E-11
IC804	G-11
IC901	D-10
IC902	C-10
Q101	B-9
Q102	B-11
Q201	C-10
Q202	B-11
Q301	B-10
Q302	C-13
Q303	B-10
Q305	C-11
Q306	H-9
Q307	C-10
Q308	B-11
Q309	B-10
Q501	E-11
Q601	F-9
Q602	F-9
Q603	G-7
Q604	H-9
Q605	G-9
Q607	H-9
Q801	G-13
Q802	F-13
Q803	F-13
Q804	F-13
Q805	F-13
Q806	F-12
Q807	F-13
Q809	D-11
Q901	C-6
Q902	D-9
Q904	C-11
Q905	C-6
Q906	C-10
Q1001	E-11

6-4. PRINTED WIRING BOARD

Note on Schematic Diagram:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•% : indicates tolerance.

•f : internal component.

•C: panel designation.

Note: The components identified by mark 0or dotted line with mark 0are critical for safety.

Replace only with part number specified.

•A: B+ Line.

•Power voltage is dc 3 V and fed with regulated dc power supply from external power voltage jack.

•Voltages and waveforms are dc with respect to ground

under no-signal conditions. no mark : PLAYBACK

( ) : RECORD

∗: Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MΩ ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PLAYBACK (ANALOG OUT)

j : PLAYBACK (ANALOG IN)

l : RECORD (DEGITAL IN)

•Abbreviation

CND : Canadian model

FR	: French model
HK	: Hong Kong model
JEW	: Tourist model

*IC502 and IC801 are not replaceable

•The voltage and waveform of CSP (chip size package) can- not be measured, because its lead layout is different form that of conventional IC.

Note on Printed Wiring Board:

•X: parts extracted from the component side.

•Y: parts extracted from the conductor side.

•x : parts mounted on the conductor side.

•z : Through hole.

•b: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from
(Conductor Side)	the pattern face are indicated.
Parts face side:	Parts on the parts face side seen from
(Component Side)	the parts face are indicated.

•Main board is four-layer printed board.

However, the patterns of layers 2 and 3 have not been in- cluded in this diagrams.

*IC502 and IC801 are not replaceable

• Lead Layouts surface

Lead layout of conventional IC CSP (chip size package)

Ver 1.2 2000. 02

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