Sony MZ-300 specifications Section Servicing Note

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MZ-E300

 

 

TABLE OF CONTENTS

 

Specifications

1

1.

SERVICING NOTE

2

2.

GENERAL

 

 

Preparing a Power Source

3

 

To Connect the Headphones/Earphones

3

 

Playing an MD

3

3.

DISASSEMBLY

 

 

3-1. “Lid ASSY, Upper”, Holder ASSY

4

 

3-2. Mechanism Deck

4

 

3-3. Main Board

5

 

3-4. Optical Pick-up ASSY

5

4.

TEST MODE

6

5.

DIAGRAMS

 

 

5-1. Explanation of IC Terminals

13

 

5-2. Block Diagram

18

 

5-3. Printed Wiring Boards – Main Section (1/2)

19

 

5-4. Printed Wiring Boards – Main Section (2/2)

20

 

5-5. Schematic Diagram – Main Section (1/3)

21

 

5-6. Schematic Diagram – Main Section (2/3)

22

 

5-7. Schematic Diagram – Main Section (3/3)

23

6.

EXPLODED VIEWS

 

 

6-1. Main Section

29

 

6-2. Mechanism Deck Section

30

7.

ELECTRICAL PARTS LIST

31

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Flexible Circuit Board Repairing

Keep the temperature of the soldering iron around 270° C during repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE

PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

SECTION 1

SERVICING NOTE

When repairing this device with the power on, if you remove the main board, this device stops working.

In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S808).

Open/Close detection switch (S808)

Note on IC replacement

If using flux on replacing IC801 etc., clean it with alcohol or equivalent, and after that, check carefully there are no dust or rags in between pins.

Especially, be sure to check between pins 4 and 5.

2

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Contents Specifications 873-064-13Section Servicing Note General LID ASSY, UPPER, Holder Assy DisassemblySection Mechanism DeckMain Board Optical PICK-UP AssyHow to set the Test Mode Section Test ModeSetting the Test Mode How to release the Test Mode Manual ModeOperations when the Test Mode is set How to set the Manual modeTest Mode Overall Adjustment ModeNV Reset Display segment check mode Electrical offset adjustment methodOverall adjustment mode structure Overall CD and MO adjustment method Ver 1.1MZ-E300 Overall CD and MO adjustment items Overall offset adjustmentIC601 LC89642-8B-E Section DiagramsExplanation of IC Terminals Pin No Pin name DescriptionLrco AvssXIN FseqPCK VcvssSetkey XresetRmckey OpenclsswSLED1FCON ClvwconSLED1RCON SLED2RCONBlock Diagrams Main BoardPrinted Wiring Boards Main /2 Refer to page 24 for NotesSemiconductor Location2121 Schematic Diagram Main /3 IC B/D2323 Digital MZ-E300 IC Block Diagrams IC551 SC111257FCR2 IC901 XPC18A32FCR2 Section Exploded Views Main SectionMechanism Deck Section MT-MZE300-176 M902Section Electrical Parts List MainElect Chip Short Revision History Date Description of Revision