AMD 30925 manual Pushing Gently Down on the Processor

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30925 Rev. 3.04 February 2004	Builder’s Guide for AMD Opteron™ Processor-
	Based Servers and Workstations

Figure 12. Pushing Gently Down on the Processor

13.Inspect the thermal interface material for scratches or gaps.

The heatsink has a thermal interface material pre-applied on the bottom. This material is protected by a plastic cover. (See Figure 13.)

Do not use the thermal interface material if it has scratches or gaps. If replacement thermal interface material is needed, contact AMD technical support for assistance at http://ask.amd.com or (408) 749-3060. In EMEA, please contact AMD technical support for assistance at http://www.amd.com/support.

If a heatsink is removed for any reason, clean the processor and heatsink surface and re-apply an AMD approved thermal interface material before re-installing the processor.

14.Remove and discard the plastic cover.

Be careful not to touch or scratch the thermal interface material.

Figure 13. Plastic Cover Over Thermal Interface Material

15.Center the heatsink over the processor. (See Figure 14 on page 24.) The mounting lug on the retention frame must match the heatsink clip. The heatsink must have full contact with the processor.

Chapter 4

Heatsink Installation

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Contents Revision Trademarks Contents EMI Reduction Techniques Servers and WorkstationsAMD Opteron Processor Architecture List of FiguresList of Tables Date Revision Description Revision HistoryRevision History AMD64 Architecture AMD Opteron Processor Key Architectural FeaturesHyperTransport Technology Other Features of the AMD Opteron ProcessorIntegrated DDR Dram Memory Controller Design Methodology for the VSP Platform Validated Server Program VSPValue Proposition Platform Description Model A2210 1U/2P Rack Server Model A8440 4U/4P Rack Server Not Yet a Member of VSP? Servers and Workstations Validated Server Program VSP AMD64 Processor-in-a-Box AMD Opteron Processor-In-a-BoxServers and Workstations AMD Opteron Processor-In-a-Box Heatsink Installation Procedure Heatsink InstallationBackplate Release Liner Ensure Proper Contact Between Backplate and Motherboard Tightening Down the Retention Frame Pushing Gently Down on the Processor Heatsink Centered Over Processor Pushing Straight Down on the Clip Turning the Cam Lever Installed Heatsink Servers and Workstations Heatsink Installation Basic Chassis Selection Guidelines Hardware ConsiderationsSystem Enclosures and Chassis Selection Basic System Enclosure Selection GuidelinesDesirable Airflow-Power Supply with Bottom Inlet Power Supply ConsiderationsServer and Workstation Platform Power Supplies Power Supply GuidelinesPower Worksheet 1-Component Power Calculating System Power ConsumptionTotal Watts A = W For Each Voltage Level Power Worksheet 2-Total WattsAMD Opteron Processor Thermal Solution Guidelines Thermal SolutionAMD Opteron Processor Information Memory Guidelines for AMD Opteron Processor- Based SystemsAMD64 AMD Opteron Processor Series and Model NumbersAMD-8000 Series Chipset AMD Chipset InformationAMD-8131 HyperTransport PCI-XTunnel Graphics and StorageAMD-8000 Series Chipset Drivers AMD Opteron Processor Utilities and UpdatesBit Operating Systems Drivers for Linux Kernel Linux Drivers for the AMD-8000 Series of Chipset ComponentsServers and Workstations Hardware Considerations Spread Spectrum Clocking EMI Reduction TechniquesEMI Emission Standards Processor Heatsink Fan Cable Routing Disable Unused ClocksPower Supply Cable Routing Rear I/O Connector ShieldProcessor Heatsink Grounding Servers and Workstations EMI Reduction Techniques Appendix a AMD Opteron Processor-Based System Build Procedure Builder’s Guide for AMD Opteron Processor Builder’s Guide for AMD Opteron Processor-Based AMD Opteron Processor FAQs Appendix B FAQsWhat is the value proposition of the AMD Opteron processor? Where are EMI guidelines for motherboards located? Validated Server Program FAQsWill these validated servers be available in all regions? Builder’s Guide for AMD Opteron Processor