30925 Rev. 3.04 February 2004 | Builder’s Guide for AMD Opteron™ Processor- |
| Based Servers and Workstations |
8. Processor Heatsink Grounding |
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Although grounding of the processor heatsink has not yet been required on any AMD Opteron
If excessive system level EMI radiated emissions exist after attempting all the listed EMI reduction techniques, then more extensive remedies may be necessary. First, determine if the emissions emanate from the system I/O cables (including the AC power cord) or from aperture leaks in the system chassis. If EMI emissions emanate from a particular I/O cable, then improved filtering or cable shielding may be required on that cable. If EMI emissions emanate from slots or seams in the chassis enclosure, use copper tape across the apertures to improve shielding effectiveness. If copper tape reduces emission levels to a satisfactory level, then chassis sheet metal changes or conductive EMI gasketing can be added at that location.
Chapter 6 | EMI Reduction Techniques | 45 |