NW-MS6
Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)
Caution: |
|
Pattern face side: | Parts on the pattern face side seen from |
(Conductor Side) | the pattern face are indicated. |
Parts face side: | Parts on the parts face side seen from |
(Component Side) | the parts face are indicated. |
|
|
•MAIN board and SUB board are
*Replacement of C5000, IC5600, IC7001and IC8000 used in this set requires a special tool.
•Lead Layouts
surface
Lead layout of conventional IC | CSP (chip size package) |
Note on Schematic Diagram:
•All capacitors are in ∝ F unless otherwise noted. pF: ∝∝ F 50 WV or less are not indicated except for electrolytics and tantalums.
•All resistors are in Ω and 1/4 W or less unless otherwise specified.
•% : indicates tolerance.
•A : B+ Line.
•Power voltage is dc 1.2 V and fed with regulated dc power supply from battery terminal.
•Voltages and waveforms are dc with respect to ground under
•no mark : PLAYBACK
( | ) : when USB connection |
•Voltages are taken with a VOM (Input impedance 10 MΩ ). Voltage variations may be noted due to normal produc- tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc- tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
F : PLAYBACK
E : Check-out
j : Check-in
*Replacement of IC5000, IC5600, IC7001and IC8000 used in this set requires a special tool.
•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.
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