HP Pro x2 612 G1 manual Remove the heat sink Removal and replacement procedures

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2.Remove the heat sink (2).

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it.

58 Chapter 5 Removal and replacement procedures

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Contents HP Pro x2 612 G1 Product notice Safety warning notice Iv Safety warning notice Table of contents Keyboard base replacement procedures Vii Viii Product description Ports Tablet WirelessCategory Description Keyboard baseRestore media Drdvd Power requirements BatteryOperating system Preinstalled Restore media OsdvdServiceability End user replaceable parts AC adapter Web-only supportComponent Description External component identificationDisplay Select the HP Support Assistant appTablet edge components External component identificationTablet edge components Keyboard base TopKeys Fn keyLights TouchPad Battery is charged from 90 to 99 percentBattery is charged from 0 to 90 percent Left sideRight side Rear Illustrated parts catalog Tablet major components ComponentPower connector cable Component Spare part number766622-001 Solid-state driveWwan module Cell, 29-WHr, 1.98-AHr, Li-ion battery includes cableWlan module Card reader board includes cableKeyboard major components Keyboard major componentsIllustrated parts catalog TouchPad button board includes cable Memory card reader board includes 2 cablesKeyboard plate Miscellaneous parts Screw Kit Travel keyboardIllustrated parts catalog Sequential part number listing Spare part number DescriptionIndia Operating system includes replacement thermal material 766625-001 Pointing stick cables Backlight, keyboard, and pointing stick cables Glass, and Wlan antenna Wlan antenna Adhesive Tools required Removal and replacement preliminary requirementsService considerations Plastic partsDrive handling Cables and connectorsGrounding guidelines Electrostatic discharge damageTypical electrostatic voltage levels Event55% Packaging and transporting guidelines Equipment guidelines Material Use Voltage protection levelBack cover Removal and replacement proceduresTablet replacement procedures Description Spare part numberPage Fingerprint reader board Button board 766613-001Page Tablet battery Solid-state drive Page Wlan module Page Wwan module Page RTC battery FanDescription Spare part number Fan includes cable 766618-001 Card reader board Page System board Windows 8 operating system Page Heat sink Remove the heat sink Removal and replacement procedures Tablet I/O board Page Power connector cable Home button boardPage Speakers Keyboard base replacement procedures Bottom coverKeyboard battery Page Keyboard plate Description Spare part number Keyboard plate 766605-001TouchPad button board Keyboard For use in country or region Spare part numberSpare part number Page Memory card reader board Keyboard base I/O board Page Keyboard base power connector cable Hinge assembly Using Computer Setup Starting Computer SetupNavigating and selecting in Computer Setup Page Restoring factory settings in Computer Setup Updating the BiosUsing MultiBoot About the boot device orderChoosing MultiBoot preferences Setting a new boot order in Computer SetupUsing HP PC Hardware Diagnostics Uefi Setting a MultiBoot Express promptPage Downloading HP PC Hardware Diagnostics Uefi to a USB device Diagnostic section, click HP Uefi Support EnvironmentSpecifications Metric Nonoperating To 12,192 m Ft to 40,000 ft Using the Windows recovery tools Backup and recoveryPerforming a system recovery Backing up your informationUsing f11 recovery tools Using Windows operating system media purchased separately Using Windows Refresh or Windows ResetUsing HP Software Setup Requirements for specific countries and regions Power cord set requirementsRequirements for all countries Country/region Accredited agency Applicable note numberRequirements for specific countries and regions Recycling Index Bezel Wwan module Removal Spare part numbers 27, 28
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