HP dc5850 manual AMD Processors, AMD Processor Overview, Processor Changing/Upgrading

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Processor/Memory Subsystem

3.2AMD Processors

These systems feature an AMD processor mounted with a heat sink in an AM2+ socket. The mounting socket allows the processor to be easily changed for upgrading.

3.2.1 AMD Processor Overview

The systems covered in this guide support AMD Phenom, Athlon, and Sempron processors.

Key features of these AMD processors include:

Single-, dual-, triple-, or quad-core architecture

Dedicated L2 cache for each core

Integrated DDR2 memory controller

Direct-connect archtitecture for improved performance between the CPU, memory, and I/O

HyperTransport™ technology providing up to 4 GB/s (each direction) in mode 1.0 and up to 7.2 GB/s in mode 3.0

Table 3-1 provides a sample listing of processors supported by these systems.

Table 3-1

Supported Processors (partial listing)

 

 

 

 

 

 

 

AMD

Core

Core

HT bus

L2

L3

Instruction set

Processor

design

Speed

mode

Cache

Cache

support (see note)

 

 

 

 

 

 

 

Phenom X4

quad

2.30 GHz

3.0

512 KB x4

2048 KB

Std. set + SSE4a,

 

 

 

 

 

 

Enhanced 3DNow!

 

 

 

 

 

 

 

Phenom X3

triple

2.40 GHz

3.0

512 KB x3

2048 KB

Std. set + SSE4a,

 

 

 

 

 

 

Enhanced 3DNow!

 

 

 

 

 

 

 

Athlon 64 X2

dual

2.80 GHz

2.0

1024 KB x2

n/a

Std. set + AMD-V

Athlon 64 X2

dual

2.70 GHz

2.0

1024 KB x2

n/a

Std. set + AMD-V

Athlon 64

single

2.40 GHz

2.0

1024 KB

n/a

Std. set

Sempron

single

2.30 GHz

1.0

512 KB

n/a

Std. set

NOTE: Standard (std.) instruction set support includes AMD64, MMX, SSE, SSE2, SSE3, 3DNow!, NX bit, Cool’n’Quiet

3.2.2 Processor Changing/Upgrading

These systems use the AM2+ zero-insertion-force mounting socket. These systems require that the processor use an integrated heatsink/fan assembly.

CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such conditions could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions.

CAUTION: These systems can only support a processor with a maximum power consumption (also known as thermal design power (TDP)) of 95 watts. Exceeding this limit can result in system damage and lost data.

 

3-2

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Technical Reference Guide

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Contents Technical Reference Guide OctoberTechnical Reference Guide Contents System Support Input/Output InterfacesPower and Signal Distribution Integrated Graphics SubsystemSystem Bios Error Messages and Codes IndexAdditional Information Sources IntroductionAbout this Guide Online ViewingSpecial Notices Serial NumberNotational Conventions ValuesCommon Acronyms and Abbreviations Acronyms and AbbreviationsAcronym or Abbreviation Description CDS Eisa LAN PAL Sdvo URL Introduction System Overview IntroductionFeatures Feature Difference Matrix by Form Factor SFFSystem Architecture HP Compaq dc5850 Business PC Architecture, Block diagram Chipset Components and Functionality AMD Processor SupportChipset Components FunctionSupport Component Functions Support ComponentsSystem Memory Component Name FunctionUniversal Serial Bus Interface Mass StorageSerial Interface Network Interface ControllerIntegrated Graphics Subsystem Statistics Integrated Graphics ProcessorAudio Subsystem Integrated Graphics ControllerPower Supply Electrical Specifications SpecificationsEnvironmental Specifications Factory Configuration Parameter Operating Non-operatingPhysical Specifications Parameter SFFSystem Overview Processor/Memory Subsystem Processor/Memory Subsystem ArchitectureProcessor Changing/Upgrading AMD ProcessorsAMD Processor Overview Supported Processors partial listingMemory Subsystem Memory Socket Loading Memory Loading/UpgradingMemory Mapping and Pre-allocation Channel a Channel B SocketSystem Memory Map for maximum of 8 gigabytes Processor/Memory Subsystem System Support PCI Bus OverviewPCI 2.3 Bus Operation Software/Driver Layer Device REQ/GNT Line PCI Connector SlotPCI Express Bus Operation Transaction Protocol LayerPCI Interrupts PCI Power Management SupportOption ROM Mapping Link LayerPCI Connectors PCI 2.3 ConnectorPCI 2.3 Bus Connector Pinout PCI Express Connectors PCI Express Bus Connector PinoutInterrupts Apic ModeSystem Resources ModePCI Interrupt Distribution Direct Memory AccessConnector PCI slot 1 J20 System Interrupts System BoardReal-Time Clock and Configuration Memory Clearing CmosStandard Cmos Locations Configuration Memory Cmos MapSystem Management Security FunctionsPower-On / Setup Password Cable Lock ProvisionInterface Security Power Management Acpi Wake-Up EventsAcpi Wake-Up Event System Wakes From Thermal Sensing and Cooling System Status PowerLED Beeps Action RequiredSystem Status System Operational Status LED IndicationsRegister Map and Miscellaneous Functions System I/O MapSystem I/O Map Port FunctionGpio Functions SB700 FunctionsSIO Controller Functions System Support Input/Output Interfaces Sata Interfaces Sata ConnectorPin Sata Connector Pinout AHCI/RAID SupportFactory Configuration for RAID Implementing Ahci RAID for Non-Factory ConfigurationsRAID 1-Mirroring with Two Hard Drives Diskette Drive Interface Pin Diskette Drive Connector Pinout Pin Signal DescriptionDB-9 Serial Connector Pinout Serial InterfaceExtended Capabilities Port Mode Standard Parallel Port ModeEnhanced Parallel Port Mode Parallel Interface SupportParallel Interface Connector DB-25 Parallel Connector PinoutPin Signal Function Keyboard/Pointing Device Interface Keyboard Interface OperationKeyboard/Pointing Device Interface Connector Keyboard/Pointing Device Connector PinoutPointing Device Interface Operation SB700 signals USB Connector Location USB ConnectorUSB Connector Pinout Universal Serial Bus InterfaceUSB Cable Length Data Signal Insulation colorUSB Cable Data USB Color CodeAudio Subsystem Functional Block Diagram Audio SubsystemHD Audio Controller HD Audio Link BusAudio Multistreaming Audio Specifications HD Audio Subsystem SpecificationsParameter Measurement Network Interface Controller LAN I/F NICPower Management Support Wake-On-LAN SupportAlert Standard Format Support NIC Specifications NIC ConnectorNIC Specifications Parameter Compatibility standard orprotocolIntegrated Graphics Processor Integrated Graphics Processor, Block diagram Functional DescriptionUpgrading Monitor Connectors Analog Monitor ConnectorDB-15 Monitor Connector Pinout DVI-D Connector DVI-D Monitor Connector PinoutPin Signal Integrated Graphics Processor Power and Signal Distribution Power DistributionSFF Power Supply SFF 240-Watt Power Supply Unit SpecificationsMin Range Current Max Surge Tolerance Loading Ripple MT Power Supply MT 300-Watt Power Supply Unit SpecificationsRange or Min Current Max Surge Tolerance Loading Ripple Power Button Actions Power ControlPower Button Pressed Power Button ResultsPower LED Indications Condition Wake Up Events Wake-On-LANState System Condition System Power StatesPower Transition OS Restart Consumption To S0 by RequiredSignal Distribution System Board Component DesignationsDesignator Component function Shows pinouts of headers used on the sytem boards Power and Signal Distribution System Bios ROM Flashing UpgradingChangeable Splash Screen Network Boot F12 Support Boot FunctionsBoot Device Order Memory Detection and ConfigurationBoot Error Codes Boot Error CodesVisual power LED Audible speaker Meaning Function Mode Client Management FunctionsClient Management Functions INT15 System ID Numbers Temperature StatusSystem ID and ROM Type System System ID Form Factor Subsystem Device IDSmbios Functions Type DataUSB Legacy Support Management FunctionsTable A-1 Beep/Power LED Codes Error Messages and CodesBeep/Power LED Codes Beeps Power LED Probable CausePower-On Self Test Post Messages Table A-2 Error Messages and Codes System Error Messages Table A-3 System Error Messages Probable CauseTable A-4 Memory Error MessagesMemory Error Messages Message Probable CauseKeyboard Error Messages Table A-5 Keyboard Error Messages Probable CauseTable A-6 Printer Error Messages Probable Cause Printer Error MessagesVideo Graphics Error Messages Table A-7 Video Graphics Error Messages Probable CauseDiskette Drive Error Messages Table A-8 Diskette Drive Error Messages Probable CauseSerial Interface Error Messages Table A-9 Serial Interface Error Messages Probable CauseModem Communications Error Messages System Status Error Messages System Status Error MessagesTable A-11 Hard Drive Error Messages Table A-12 Hard Drive Error Messages Probable CauseXx = 03, Hard drive read/write compare test Table A-13 Hard Drive Error Messages Probable Cause Audio Error Messages Table A-14 Video Graphics Error Messages Probable CauseTable A-15 Audio Error Messages Probable Cause DVD/CD-ROM Error Messages 17 DVD/CD-ROM Error MessagesNetwork Interface Error Messages Table A-17 Network Interface Error Messages Probable CauseScsi Interface Error Messages 65xx-xx, 66xx-xx Table A-18 Scsi Interface Error MessagesPointing Device Interface Error Messages 8601-xx Error Messages and Codes Index NumericsIndex
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dc5850 specifications

The HP dc5850 is a desktop computer that was designed for business environments, offering a blend of performance, reliability, and efficiency. Released during the height of the mid-2000s, this system is powered by AMD processors, particularly the Athlon or Phenom series, which ensures that it can handle various computational tasks with ease.

The dc5850 features a compact chassis that adheres to the Microtower form factor. This design not only saves space but also allows for easier upgrades and maintenance. The unit typically supports a range of RAM configurations, with options for up to 8GB of DDR2 memory. This flexibility enables the user to tailor the system's performance according to their needs, whether for basic office tasks or more demanding applications.

Storage options on the HP dc5850 include a 3.5-inch HDD that can accommodate substantial data, with capacities typically ranging from 160GB to 1TB. The inclusion of a SATA interface ensures fast data transfer rates, which is essential for improving overall system performance. Moreover, the dc5850 boasts multiple USB ports, including USB 2.0 and sometimes even USB 3.0, facilitating easy connectivity with peripherals such as printers, scanners, and external drives.

Graphics capabilities on the dc5850 are generally provided by integrated solutions, although users have the option to add discrete graphics cards for enhanced performance in visual tasks. The system often comes with integrated audio, which supports basic multimedia needs without requiring additional sound cards.

In terms of connectivity, the HP dc5850 features built-in Ethernet for wired networking and may also offer options for Wi-Fi capabilities via PCI expansion slots. This makes it suitable for networked business environments, enabling seamless integration into office infrastructures.

The system is designed with energy efficiency in mind, complying with various environmental standards, thereby reducing its carbon footprint. This aspect may also lead to lower operational costs for businesses focused on sustainability.

Overall, the HP dc5850 stands out as a versatile desktop solution, catering to the essential needs of small to medium-sized businesses. With its combination of performance, expandability, and energy efficiency, it remains a noteworthy choice for users seeking reliable computing power in a compact and manageable form.