HP dc7800 manual Processor Changing/Upgrading, Supported Processors, Clock, Form

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Processor/Memory Subsystem

3.2.2 Processor Changing/Upgrading

All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment clip are specially designed provide maximum heat transfer from the processor component.

CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such a condition could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions.

These sysems are available with one of the following processors listed in Table 3-1.

Table 3-1

Supported Processors

 

 

 

 

 

 

 

 

 

 

Clock

FSB

 

Form

Intel

Core

 

Speed

Speed

L2

Factor

Model

design

Features

in GHz

in MHz

Cache

support

 

 

 

 

 

 

 

Q6700

quad

VT, [1]

2.66

1066

8 MB

SFF, CMT

Q6600

quad

VT, [1]

2.40

1066

8 MB

SFF, CMT

E6850

dual

vPro, VT, TXT, [1]

3.00

1333

4 MB

all

E6750

dual

vPro, VT, TXT, [1]

2.66

1333

4 MB

all

E6550

dual

vPro, VT, TXT, [1]

2.33

1333

4 MB

all

E4500

dual

[1]

2.20

800

2 MB

all

E4400

dual

[1]

2.00

800

2 MB

all

E2180

dual

[1]

2.00

800

1 MB

all

E2160

dual

[1]

1.80

800

1 MB

all

440

single

[1]

2.00

800

512 KB

all

NOTE:

[1]Standard Intel feature set including EM64T, XD, and EIST support. Refer to www.Intel.com for detailed information.

CAUTION: The USDT form factor can support a processor with a maximum power consumption of 65 watts. The SFF and CMT form factors can support a processor with a maximum power consumption of 95 watts. Exceeding these limits can result in system damage and lost data.

 

Technical Reference Guide

www.hp.com

3-3

Image 35
Contents October Technical Reference GuideTechnical Reference Guide Contents Input/Output Interfaces Processor/Memory SubsystemSystem Support Integrated Graphics Subsystem Power and Signal DistributionError Messages and Codes Index System BiosOnline Viewing About this GuideAdditional Information Sources Model Numbering ConventionIntroduction Values Serial NumberNotational Conventions Special NoticesAcronyms and Abbreviations Acronym or Description Common Acronyms and AbbreviationsCPU CMCCmos CPQFPU EscdFifo FPMAcronym or Abbreviation Description Acronyms and AbbreviationsPCM PCAPCI PCI-ESmart SgramSimd SimmVGA VACVDC VesaIntroduction System OverviewFeatures 4GB 8GB Feature Difference Matrix by Form FactorSodimm Dimm Function System ArchitectureArchitectural Differences By Form Factor HP Comapq dc7800 Business PC Architecture, Block diagram Intel Processor Support Components Function ChipsetChipset Components and Functionality Component Name Function Support ComponentsSystem Memory Support Component FunctionsNetwork Interface Controller Mass StorageSerial and Parallel Interfaces Universal Serial Bus InterfaceIntegrated Graphics Controller Graphics SubsystemAudio Subsystem Integrated Graphics Subsystem StatisticsParameter Operating Non-operating SpecificationsEnvironmental Specifications Factory Configuration Power Supply Electrical SpecificationsParameter Usdt SFF CMT Physical SpecificationsParameter Measurement Diskette Drive SpecificationsCD-RW/DVD-ROM Combo LightScribe Combo Optical Drive SpecificationsDVD/CD-RW SuperMulti ParameterParameter 80 GB 160 GB 250 GB Hard Drive Specifications System Overview Processor/Memory Subsystem Intel Processor Overview Intel ProcessorsForm Processor Changing/UpgradingSupported Processors ClockMemory Subsystem Channel a Channel B Socket Socket 2 Socket 4 Total Memory UpgradingMemory Mapping and Pre-allocation Memory Socket LoadingSystem Memory Map for maximum of 8 gigabytes PCI 2.3 Bus Operation PCI Bus OverviewPCI Component Function # Device # Wired to PCI Component Configuration Access PCI BusPCI Bus Mastering Devices PCI Express Bus OperationSoftware/Driver Layer Transaction Protocol LayerLink Layer PCI Power Management SupportOption ROM Mapping PCI InterruptsPCI 2.3 Bus Connector Pinout PCI ConnectorsPCI 2.3 Connector PCI Express Bus Connector Pinout PCI Express ConnectorsMode Apic ModeSystem Resources InterruptsSystem Interrupts System Board Direct Memory AccessConnector PCI slot 1 PCI slot 2 PCI slot 3 PCI Interrupt DistributionClearing Cmos Real-Time Clock and Configuration MemorySecurity Functions Configuration Memory Cmos MapSystem Management Standard Cmos LocationsInterface Security Power-On / Setup PasswordSetup Password Cable Lock ProvisionAcpi Wake-Up Event System Wakes From Power ManagementSmart Cover Lock Optional Acpi Wake-Up EventsSystem Operational Status LED Indications System Status PowerLED Beeps Action RequiredSystem Status Thermal Sensing and CoolingSystem I/O Map Register Map and Miscellaneous FunctionsSystem I/O Map Gpio FunctionsICH9 Functions Controller Functions Input/Output Interfaces Pin Description Pin Sata Connector PinoutSata Interface Pata Interface Pin Slim IDE Connector PinoutPin Signal Diskette Drive Interface Pin Signal Description Pin Diskette Drive Connector PinoutSerial Interface DB-9 Serial Connector PinoutParallel Interface Standard Parallel Port ModeEnhanced Parallel Port Mode Extended Capabilities Port ModePin Signal Function Parallel Interface ConnectorDB-25 Parallel Connector Pinout Keyboard Interface Operation Keyboard/Pointing Device InterfaceData Keyboard/Pointing Device Interface ConnectorKeyboard/Pointing Device Connector Pinout Pointing Device Interface OperationUniversal Serial Bus Interface USB ConnectorUSB Connector Location Controller Signals USDT, SFF Form Factors CMT Form FactorUSB Color Code USB Connector PinoutUSB Cable Data USB Cable Length DataAudio Subsystem Audio Subsystem Functional Block DiagramAudio Multistreaming HD Audio ControllerHD Audio Link Bus ADC/DAC Audio SpecificationsHD Audio Subsystem Specifications LAN I/F NIC Network Interface ControllerAlert Standard Format Support Power Management SupportWake-On-LAN Support Parameter Compatibility standard orprotocol NIC ConnectorNIC Specifications NIC SpecificationsIntegrated Graphics Subsystem Functional Description Q35 IGC, Block diagramIGC Standard 2D Display Modes Sdram Installed Maximum Memory AllocationDisplay Modes Resolution Maximum Refresh Rate Analog Digital MonitorUpgrading DB-15 Monitor Connector Pinout Monitor ConnectorsAnalog Monitor Connector Digital Monitor Connector Integrated Graphics Subsystem Usdt Power Distribution Power DistributionUsdt 135-Watt Power Supply Unit Specifications SFF Power DistributionMin Range Current Max Surge Tolerance Loading Ripple SFF 240-Watt Power Supply Unit SpecificationsRange or Min Current Max Surge Tolerance Loading Ripple CMT Power DistributionCMT 365-Watt Power Supply Unit Specifications Energy Star Compliancy Shows the power supply cabling for CMT systemsPressed Power Button Results Power ControlPower Button Power Button ActionsPower Button Actions Power LED Condition Wake-On-LAN Wake Up EventsConsumption To S0 by Required System Power StatesPower Transition OS Restart State System ConditionCR1 +5 VDC LED Signal DistributionSystem Board Component Designations Power and Signal Distribution System Bios Changeable Splash Screen ROM FlashingUpgrading Memory Detection and Configuration Boot FunctionsBoot Device Order Network Boot F12 SupportVisual power LED Audible speaker Meaning Boot Error CodesBoot Error Codes Client Management Functions INT15 Function ModeClient Management Functions System ID Numbers Temperature StatusDrive Fault Prediction System ID and ROM TypeType Data SmbiosManagement Engine Functions USB Legacy SupportNumerics IndexIndex
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