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Hardware Specifications and Configurations
Processor
Item | Specification |
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|
CPU | AMD CPU S1g2 Processor (Griffin Series - Turion / Sempron); |
| HT3 (1.2~2.6 GT/s) (Bandwidth: 9.6GB/S to 20.8GB/s) |
|
|
Type | 1.8GHZ~2.3GHZ |
|
|
CPU package | AMD 638 pin |
|
|
Features | • Hyper Transport 3.0 Technology: Designed to support HT |
| Gen3 speeds from 1.2GHZ to 2.6GHZ. |
| • |
| |
| • Split Power Planes: Separate power planes provided for each |
| CPU core and on die Northbridge |
| • Up to 2 processor cores per die, Up to 1MB L2 cache per die. |
| • Each CPU core supports up to 8 |
| performance) and P7 |
|
|
CPU Power | • VDD0, VDD1 set according to the respective |
| when core VDD are isolated and VDD set according to the |
| CPU core in the highest performance |
| common. |
| • CPU_VDDNB; VLDT 1.2V_HT; VDD I/O 1.8VSUS; CPU |
| Memory Interface |
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|
North Bridge |
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Item | Specification |
|
|
Type | AMD RS780M (North Bridge) |
|
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Package | FCBGA |
|
|
Features | • CPU Hyper Transport Interface: Support |
| Transport 3.0 interface up to 5.2GT/S. |
| • PCI Express Interface: Support |
| to peer and general purpose link performance; Highly flexible |
| PCI Express implementation to suit a variety of platform needs. |
| • |
| for connection |
|
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Power | 1.1V, 1.2V, 1.8V, 3.3V |
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18 | Chapter 1 |