Cypress CY62157E Thermal Resistance9, AC Test Loads and Waveforms, Data Retention Waveform11

CY62157E MoBL®

Thermal Resistance[9]

Parameter	Description	Test Conditions	TSOP II	VFBGA	Unit
ΘJA	Thermal Resistance	Still Air, soldered on a 3 × 4.5 inch,	77	72	°C/W
	(Junction to Ambient)	two-layer printed circuit board
ΘJC	Thermal Resistance		13	8.86	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

R1

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

	3V	ALL INPUT PULSES
			90%
	10%	90%		10%
R2	GND
	Rise Time = 1 V/ns			Fall Time = 1 V/ns

Equivalent to: THEVENIN EQUIVALENT

RTH

OUTPUT V

Parameters	Values	Unit
R1	1800	Ω
R2	990	Ω
RTH	639	Ω
VTH	1.77	V

Data Retention Characteristics (Over the Operating Range)

Parameter	Description			Conditions		Min		Typ[4]	Max	Unit
VDR	VCC for Data Retention						2			V
ICCDR	Data Retention Current	VCC=2V,		1> VCC – 0.2V,	Industrial				8	∝A
			CE
		CE2 < 0.2V, VIN > VCC – 0.2V or VIN < 0.2V
					Automotive				30
tCDR[9]	Chip Deselect to Data						0			ns
	Retention Time
t [10]	Operation Recovery Time					t	RC			ns
R

Data Retention Waveform[11]

DATA RETENTION MODE

VCC	VCC(min)	VDR > 2 V	VCC(min)
CE1or	tCDR		tR
BHE.BLE
CE2

Notes:

10.Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 ∝s or stable at VCC(min) > 100 ∝s.

11.BHE.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.

Document #: 38-05695 Rev. *C Page 4 of 12

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