CY62167EV30 MoBL®

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of the device. These user guidelines are not tested.

Storage Temperature

–65°C to + 150°C

Ambient Temperature with

 

Power Applied

–55°C to + 125°C

Supply Voltage to Ground

 

Potential

–0.3V to 3.9V VCC(max) + 0.3V

DC Voltage Applied to Outputs

in High Z State[6, 7]

–0.3V to 3.9V VCC(max) + 0.3V

DC Input Voltage[6, 7]

...........–0.3V to 3.9V (VCC(max) + 0.3V

Output Current into Outputs (LOW)

20 mA

Static Discharge Voltage

 

>2001V

(MIL-STD-883, Method 3015)

 

 

Latch up Current

 

>200 mA

Operating Range

 

 

 

 

 

 

 

Device

 

Range

Ambient

[8]

 

Temperature

VCC

CY62167EV30LL

Industrial/

–40°C to +85°C

2.2V to 3.6V

 

 

Auto-A

 

 

Electrical Characteristics

Over the Operating Range

Parameter

Description

 

 

 

Test Conditions

45 ns (Industrial/Auto-A)

Unit

 

 

 

Min

Typ[5]

Max

 

 

 

 

 

 

 

 

VOH

Output HIGH Voltage

 

2.2 < VCC < 2.7

IOH = –0.1 mA

2.0

 

 

V

 

 

 

2.7 < VCC < 3.6

IOH = –1.0 mA

2.4

 

 

V

VOL

Output LOW Voltage

2.2 < VCC < 2.7

IOL = 0.1 mA

 

 

0.4

V

 

 

 

2.7 < VCC < 3.6

IOL = 2.1mA

 

 

0.4

V

VIH

Input HIGH Voltage

2.2 < VCC < 2.7

 

1.8

 

VCC + 0.3V

V

 

 

 

2.7 < VCC < 3.6

 

2.2

 

VCC + 0.3V

V

VIL

Input LOW Voltage

2.2 < VCC < 2.7

 

–0.3

 

0.6

V

 

 

 

2.7 < VCC < 3.6

For VFBGA package

–0.3

 

0.8

V

 

 

 

 

 

 

For TSOP I package

–0.3

 

0.7[9]

V

IIX

Input Leakage Current

GND < VI < VCC

 

–1

 

+1

μA

IOZ

Output Leakage Current

GND < VO < VCC, Output Disabled

–1

 

+1

μA

ICC

VCC Operating Supply

 

f = fMAX = 1/tRC

VCC = VCC(max)

 

25

30

mA

 

Current

 

 

IOUT = 0 mA

 

 

 

 

 

 

f = 1 MHz

 

2.2

4.0

mA

 

 

 

 

 

 

CMOS levels

 

 

 

 

ISB1

Automatic CE Power Down

 

 

1 > VCC 0.2V or CE2 < 0.2V

 

1.5

12

μA

 

CE

 

 

Current—CMOS Inputs

 

VIN > VCC 0.2V, VIN < 0.2V,

 

 

 

 

 

 

 

f = fMAX (Address and Data Only),

 

 

 

 

 

 

 

f = 0 (OE, WE, BHE and BLE), VCC = 3.60V

 

 

 

 

ISB2[10]

Automatic CE Power Down

 

 

1 > VCC 0.2V or CE2 < 0.2V,

 

1.5

12

μA

 

CE

 

 

Current—CMOS Inputs

 

VIN > VCC 0.2V or VIN < 0.2V,

 

 

 

 

 

 

 

f = 0, VCC = 3.60V

 

 

 

 

 

Capacitance

Tested initially and after any design or process changes that may affect these parameters.

Parameter

Description

Test Conditions

Max

Unit

CIN

Input Capacitance

TA = 25°C, f = 1 MHz,

10

pF

 

 

VCC = VCC(typ)

 

 

COUT

Output Capacitance

10

pF

Notes

6.VIL(min) = –2.0V for pulse durations less than 20 ns.

7.VIH(max) = VCC + 0.75V for pulse durations less than 20 ns.

8.Full Device AC operation assumes a 100 μs ramp time from 0 to VCC (min) and 200 μs wait time after VCC stabilization.

9.Under DC conditions the device meets a VIL of 0.8V. However, in dynamic conditions Input LOW Voltage applied to the device must not be higher than 0.7V. This is applicable to TSOP I package only.

10.Only chip enables (CE1 and CE2), byte enables (BHE and BLE) and BYTE must be tied to CMOS levels to meet the ISB2 / ICCDR spec. Other inputs can be left floating

Document #: 38-05446 Rev. *E

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Cypress CY62167EV30 manual Maximum Ratings, Operating Range, Electrical Characteristics, Capacitance