CY62167EV30 MoBL®
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of the device. These user guidelines are not tested.
Storage Temperature | |
Ambient Temperature with |
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Power Applied | |
Supply Voltage to Ground |
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Potential | |
DC Voltage Applied to Outputs | |
in High Z State[6, 7] |
DC Input Voltage[6, 7] | ||||
Output Current into Outputs (LOW) | 20 mA | |||
Static Discharge Voltage |
| >2001V | ||
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Latch up Current |
| >200 mA | ||
Operating Range |
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Device |
| Range | Ambient | [8] |
| Temperature | VCC | ||
CY62167EV30LL | Industrial/ | 2.2V to 3.6V | ||
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Electrical Characteristics
Over the Operating Range
Parameter | Description |
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| Test Conditions | 45 ns | Unit | |||
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| Min | Typ[5] | Max | |||||
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VOH | Output HIGH Voltage |
| 2.2 < VCC < 2.7 | IOH = | 2.0 |
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| V | ||
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| 2.7 < VCC < 3.6 | IOH = | 2.4 |
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| V | ||
VOL | Output LOW Voltage | 2.2 < VCC < 2.7 | IOL = 0.1 mA |
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| 0.4 | V | |||
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| 2.7 < VCC < 3.6 | IOL = 2.1mA |
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| 0.4 | V | ||
VIH | Input HIGH Voltage | 2.2 < VCC < 2.7 |
| 1.8 |
| VCC + 0.3V | V | |||
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| 2.7 < VCC < 3.6 |
| 2.2 |
| VCC + 0.3V | V | ||
VIL | Input LOW Voltage | 2.2 < VCC < 2.7 |
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| 0.6 | V | ||||
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| 2.7 < VCC < 3.6 | For VFBGA package |
| 0.8 | V | |||
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| For TSOP I package |
| 0.7[9] | V | |
IIX | Input Leakage Current | GND < VI < VCC |
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| +1 | μA | ||||
IOZ | Output Leakage Current | GND < VO < VCC, Output Disabled |
| +1 | μA | |||||
ICC | VCC Operating Supply |
| f = fMAX = 1/tRC | VCC = VCC(max) |
| 25 | 30 | mA | ||
| Current |
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| IOUT = 0 mA |
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| f = 1 MHz |
| 2.2 | 4.0 | mA | ||||
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| CMOS levels |
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ISB1 | Automatic CE Power Down |
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| 1 > VCC − 0.2V or CE2 < 0.2V |
| 1.5 | 12 | μA | ||
| CE |
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| VIN > VCC − 0.2V, VIN < 0.2V, |
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| f = fMAX (Address and Data Only), |
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| f = 0 (OE, WE, BHE and BLE), VCC = 3.60V |
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ISB2[10] | Automatic CE Power Down |
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| 1 > VCC − 0.2V or CE2 < 0.2V, |
| 1.5 | 12 | μA | ||
| CE |
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| VIN > VCC − 0.2V or VIN < 0.2V, |
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| f = 0, VCC = 3.60V |
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Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter | Description | Test Conditions | Max | Unit |
CIN | Input Capacitance | TA = 25°C, f = 1 MHz, | 10 | pF |
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| VCC = VCC(typ) |
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COUT | Output Capacitance | 10 | pF |
Notes
6.VIL(min) =
7.VIH(max) = VCC + 0.75V for pulse durations less than 20 ns.
8.Full Device AC operation assumes a 100 μs ramp time from 0 to VCC (min) and 200 μs wait time after VCC stabilization.
9.Under DC conditions the device meets a VIL of 0.8V. However, in dynamic conditions Input LOW Voltage applied to the device must not be higher than 0.7V. This is applicable to TSOP I package only.
10.Only chip enables (CE1 and CE2), byte enables (BHE and BLE) and BYTE must be tied to CMOS levels to meet the ISB2 / ICCDR spec. Other inputs can be left floating
Document #: | Page 3 of 14 |
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