CY62167EV30 MoBL®

16-Mbit (1M x 16 / 2M x 8) Static RAM

Features

TSOP I Package Configurable as 1M x 16 or 2M x 8 SRAM

Very High Speed: 45 ns

Temperature Ranges

Industrial: –40°C to +85°C

Automotive-A: –40°C to +85°C

Wide Voltage Range: 2.20V to 3.60V

Ultra Low Standby Power

Typical standby current: 1.5 μA

Maximum standby current: 12 μA

Ultra Low Active Power

Typical active current: 2.2 mA @ f = 1 MHz

Easy Memory Expansion with CE1, CE2, and OE Features

Automatic Power Down when Deselected

CMOS for Optimum Speed and Power

Offered in Pb-free 48-Ball VFBGA and 48-Pin TSOP I Packages

Functional Description

The CY62167EV30 is a high performance CMOS static RAM organized as 1M words by 16 bits or 2M words by 8 bits. This device features an advanced circuit design that provides an ultra

low active current. Ultra low active current is ideal for providing More Battery Life(MoBL®) in portable applications such as cellular telephones. The device also has an automatic power down feature that reduces power consumption by 99 percent when addresses are not toggling. Place the device into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input and output pins (I/O0 through I/O15) are placed in a high impedance state when: the device is deselected (CE1 HIGH or CE2 LOW), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or a write operation is in progress (CE1 LOW, CE2 HIGH and WE LOW).

To write to the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7) is written into the location specified on the address pins (A0 through A19). If Byte High Enable (BHE) is LOW, then data from the I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A19).

To read from the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appears on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory appears on I/O8 to I/O15. See the “Truth Table” on page 9 for a complete description of read and write modes.

For best practice recommendations, refer to the Cypress application note AN1064, SRAM System Guidelines.

Logic Block Diagram

 

DATA IN DRIVERS

 

 

 

A10

 

 

 

 

 

 

 

 

 

A 9

ROWDECODER

 

 

 

 

 

SENSE AMPS

 

 

A 8

 

 

 

 

 

 

 

A 7

1M × 16 / 2M x 8

 

 

A 6

 

 

A 5

 

RAM Array

IO –IO

7

A 4

 

 

 

 

 

0

 

 

 

 

 

IO8–IO15

A 3

 

 

 

 

 

A 2

 

 

 

 

 

 

 

 

 

A 1

 

 

 

 

 

 

 

 

 

A 0

 

 

 

 

 

 

 

 

 

 

 

COLUMN DECODER

 

 

 

 

 

 

 

 

 

 

BYTE

 

 

CE2

 

 

 

 

 

 

BHE

 

 

11

12

13

14

15 16 17 18

19

WE

CE2

Power Down

CE1

 

CE1

 

A A A A A A A A A

OE

Circuit

BHE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BLE

 

 

BLE

 

 

 

 

 

 

 

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document #: 38-05446 Rev. *E

 

Revised March 23, 2009

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Cypress CY62167EV30 manual Features, Functional Description, Logic Block Diagram