CY62167EV30 MoBL®
Document #: 38-05446 Rev. *E Page 13 of 14
Document History Page
Document Title: CY62167EV30 MoBL® 16-Mbit (1M x 16 / 2M x 8) Static RAM
Document Number: 38-05446
REV. ECN NO. Orig. of
Change
Submission
Date Description of Change
** 202600 AJU 01/23/2004 New Data Sheet
*A 46 3674 NXR See ECN Converted from Advance Information to Preliminary
Removed ‘L’ bin and 35 ns speed bin from product offering
Modified Data sheet to include x8 configurability.
Changed ball E3 in FBGA pinout from DNU to NC
Changed the ISB2(Typ) value from 1.3 μA to 1.5 μA
Changed the ICC(Max) value from 40 mA to 25 mA
Changed Vcc stabilization time in footnote #9 from 100 µs to 200 µs
Changed the AC Test Load Capacitance value from 50 pF to 30 pF
Corrected typo in Data Retention Characteristics (tR) from 100 µs to tRC ns
Changed tOHA, tLZCE, tLZBE, and tLZWE from 6 ns to 10 ns
Changed tLZOE from 3 ns to 5 ns.
Changed tHZOE, tHZCE, tHZBE, and tHZWE from 15 ns to 18 ns
Changed tSCE, tAW, and tBW from 40 ns to 35 ns
Changed tPE from 30 ns to 35 ns
Changed tSD from 20 ns to 25 ns
Updated 48 ball FBGA Package Information.
Updated the Ordering Information table
*B 46 9169 NSI See ECN Minor Change: Moved to external web
*C 1130323 VKN See ECN Converted from preliminary to final
Changed ICC max spec from 2.8 mA to 4.0 mA for f=1MHz
Changed ICC typ spec from 22 mA to 25 mA for f=fmax
Changed ICC max spec from 25 mA to 30 mA for f=fmax
Added VIL spec for TSOP I package and footnote# 9
Added footnote# 10 related to ISB2 and ICCDR
Changed ISB1 and ISB2 spec from 8.5 μA to 12 μA
Changed ICCDR spec from 8 μA to 10 μA
Added footnote# 15 related to AC timing parameters
*D 1323984 VKN/AESA See ECN Modified ICCDR spec for TSOP I package
Added 48-Ball VFBGA (6 x 7 x 1mm) package
Added footnote# 1 related to VFBGA (6 x 7 x 1mm) package
Updated Ordering Information table
*E 2678799 VKN/PYRS 03/25/2009 Added Automotive-A information
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