CY62167EV30 MoBL®
Document #: 38-05446 Rev. *E Page 2 of 14

Pin Configuration

Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View [1, 2, 3]
Figure 2. 48-Pin TSOP I Top View [3, 4]

Product Portfolio

Product VCC Range (V) Speed

(ns)

Power Dissipation

Range Operating ICC (mA) Standby ISB2

(μA)

f = 1 MHz f = fmax

Min Typ[5] Max Typ [5] Max Typ[5] Max Typ [5] Max

CY62167EV30LL Industrial/Auto-A 2.2 3.0 3.6 45 2.2 4.0 25 30 1.5 12

WE
A11
A10
A6
A0
CE1
I/O
10
I/O
8
I/O
9
A4
A5
I/O
11
I/O
13
I/O
12
I/O
14
I/O
15
V
SS
A9
A8
OE
Vss
A7
I/O
0
BHE
CE2
A17
BLE
V
CC
I/O
2
I/O
1
I/O
3
I/O
4
I/O
5I/O
6
I/O
7
A15
A14
A13
A
12
A19
A18 NC
3
26
5
4
1
D
E
B
A
C
F
G
H
A16
NC
VCC
A1A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE
CE
2
NC
BHE
BLE
A18
A17
A7
A6
A5
A4
A3
A2
A1
A16
BYTE
Vss
IO15/A20
IO7
IO14
IO6
IO13
IO5
IO12
IO4
Vcc
IO11
IO3
IO10
IO2
IO9
IO1
IO8
IO0
OE
Vss
CE
1
A0
Notes
1. The information related to 6 x 7 x 1 mm VFBGA package is preliminary.
2. Ball H6 for the VFBGA package can be used to upgrade to a 32M density.
3. NC pins are not connected on the die.
4. The BYTE pin in the 48-TSOPI package has to be tied to VCC to use the device as a 1M X 16 SRAM. The 48-TSOP I package can also be used as a 2M X 8 SRAM
by tying the BYTE signal to VSS. In the 2M x 8 configuration, Pin 45 is A20, while BHE, BLE and IO8 to IO14 pins are not used.
5. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.
[+] Feedback