CY7C1217H

Maximum Ratings

(Above which the useful life may be impaired. For user guide- lines, not tested.)

Storage Temperature

–65°C to + 150°C

Ambient Temperature with

 

 

Power Applied

–55°C to + 125°C

Supply Voltage on VDD Relative to GND

–0.5V to + 4.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to + VDD

DC Voltage Applied to Outputs

 

 

in Tri-State

–0.5V to VDDQ + 0.5V

Electrical Characteristics Over the Operating Range [7, 8]

DC Input Voltage

...................................

 

 

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

 

20 mA

Static Discharge Voltage

 

>2001V

(per MIL-STD-883, Method 3015)

 

 

Latch-up Current

 

 

 

 

 

>200 mA

Operating Range

 

 

 

 

 

 

 

 

 

 

Ambient

]

VDD

VDDQ

Range

Temperature

Commercial

0°C to +70°C

3.3V

2.5V –5%

 

 

 

 

 

5%/+10%

to VDD

Industrial

–40

°

 

°

 

C to +85 C

 

 

Parameter

Description

Test Conditions

Min.

Max.

Unit

VDD

Power Supply Voltage

 

 

3.135

3.6

V

VDDQ

I/O Supply Voltage

for 3.3V I/O

 

3.135

VDD

V

 

 

 

for 2.5V I/O

 

2.375

2.625

V

 

 

 

 

 

 

 

VOH

Output HIGH Voltage

for 3.3V I/O, IOH = –4.0 mA

 

2.4

 

V

 

 

 

for 2.5V I/O, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 3.3V I/O, IOL = 8.0 mA

 

 

0.4

V

 

 

 

for 2.5V I/O, IOL = 1.0 mA

 

 

0.4

V

V

IH

Input HIGH Voltage[7]

for 3.3V I/O

 

2.0

V + 0.3V

V

 

 

 

 

 

DD

 

 

 

 

for 2.5V I/O

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[7]

for 3.3V I/O

 

–0.3

0.8

V

 

 

 

for 2.5V I/O

 

–0.3

0.7

V

 

 

 

 

 

 

 

IX

Input Leakage Current

GND VI VDDQ

 

5

5

A

 

 

except ZZ and MODE

 

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

 

Input = VDD

 

 

5

A

 

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

–5

5

A

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

7.5-ns cycle, 133 MHz

 

225

mA

 

 

Current

f = fMAX= 1/tCYC

 

 

 

 

 

 

10-ns cycle, 100 MHz

 

205

mA

ISB1

Automatic CE

Max. VDD, Device Deselected,

7.5-ns cycle, 133 MHz

 

90

mA

 

 

Power-Down

VIN VIH or VIN VIL, f = fMAX,

 

 

 

 

 

 

10-ns cycle, 100 MHz

 

80

mA

 

 

Current—TTL Inputs

inputs switching

 

 

 

 

ISB2

Automatic CE

Max. VDD, Device Deselected,

All speeds

 

40

mA

 

 

Power-Down

VIN VDD – 0.3V or VIN 0.3V,

 

 

 

 

 

 

Current—CMOS Inputs

f = 0, inputs static

 

 

 

 

ISB3

Automatic CE

Max. VDD, Device Deselected,

7.5-ns cycle, 133 MHz

 

75

mA

 

 

Power-Down

VIN VDDQ – 0.3V or VIN 0.3V,

 

 

 

 

 

 

10-ns cycle, 100 MHz

 

65

mA

 

 

Current—CMOS Inputs

f = fMAX, inputs switching

 

 

 

 

ISB4

Automatic CE

Max. VDD, Device Deselected,

All speeds

 

45

mA

 

 

Power-Down

VIN VDD – 0.3V or VIN 0.3V,

 

 

 

 

 

 

Current—TTL Inputs

f = 0, inputs static

 

 

 

 

Notes:

7.Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (Pulse width less than tCYC/2).

8.TPower-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document #: 38-05670 Rev. *B

Page 8 of 16

[+] Feedback

Page 8
Image 8
Cypress CY7C1217H manual Maximum Ratings, Operating Range, Ambient, Description Test Conditions Min Max Unit

CY7C1217H specifications

The Cypress CY7C1217H is a high-performance synchronous static random-access memory (SRAM) device that offers an array of features making it suitable for a diverse range of applications. With a configuration of 1 Meg x 16 bits, this component is well-suited for use in high-speed data processing systems, instrumentation, networking, and other applications that demand rapid-read and write cycles.

One of the standout features of the CY7C1217H is its high-speed operation. It supports a clock frequency of up to 167 MHz, making it ideal for systems that require fast data access and transfer rates. This high-speed capability is complemented by a low-power consumption profile, which is critical for battery-operated devices and energy-efficient applications. The part operates on a supply voltage of 1.65V to 1.95V, allowing for compatibility with modern low-voltage digital systems.

The device utilizes a dual-port architecture, enabling simultaneous access from multiple processors or data buses. This dual-port design significantly improves performance by allowing multiple data transactions to occur simultaneously, thus increasing overall system throughput. Additionally, the CY7C1217H features an asynchronous read and write capability, allowing for flexible operation in various system configurations.

In terms of memory organization, the CY7C1217H employs a multiplexed address input design, which helps optimize pin count and leads to more efficient PCB layouts. The use of a XY address decoding scheme allows for straightforward integration into existing systems while maintaining high performance.

Another notable characteristic of this SRAM is its reliability and durability. The device is built using Cypress's advanced trench technology, providing inherent robustness against environmental stress factors. This ensures a longer lifespan and improved performance consistency over time.

Furthermore, the CY7C1217H supports a range of operating temperatures, making it suitable for both commercial and industrial applications. Whether used in consumer electronics or critical industrial control systems, this SRAM's versatility ensures it can meet diverse design requirements.

In summary, the Cypress CY7C1217H synchronous SRAM combines high-speed performance, low power consumption, and dual-port capabilities with robust design characteristics. Its versatility and reliability make it an excellent choice for engineers looking to enhance their high-performance applications across various sectors.