Package Diagrams, Pin Tqfp 14 x 20 x 1.4 mm

CY7C1350G

Package Diagrams

100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)

16.00±0.20

14.00±0.10

1.40±0.05

100	81
1	80

22.00±0.20

20.00±0.10

0.30±0.08

0.65	12° ±1°
TYP.	(8X)

SEE DETAIL

0.20 MAX.

1.60 MAX.

R 0.08 MIN. 0.20 MAX.

0.25

0° MIN.

SEATING PLANE

STAND-OFF

0.05 MIN.NOTE:

0.15 MAX.

0.10

GAUGE PLANE

0° -7°

0.60±0.15

1.00 REF.

R 0.08 MIN. 0.20 MAX.

0.20 MIN.

DETAIL A

1.JEDEC STD REF MS-026

2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH

3.DIMENSIONS IN MILLIMETERS

51-85050-*B

Document #: 38-05524 Rev. *F

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Cypress CY7C1350G manual Package Diagrams, Pin Tqfp 14 x 20 x 1.4 mm

Contents

Logic Block Diagram FeaturesCypress Semiconductor Corporation Champion Court San Jose , CA Document # 38-05524 Rev. *F Selection Guide Pin ConfigurationsCY7C1350G 250 MHz 200 MHz 166 MHz 133 MHz 100 MHz Unit Pin Definitions Pin Configurations Ball BGA PinoutName Description Byte Write Inputs, active LOW . Qualified with Functional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDD Partial Truth Table for Read/Write 2, 3 ZZ Mode Electrical CharacteristicsOperation Address Used Function Maximum Ratings Electrical Characteristics Over the Operating Range10Operating Range Ambient Range Thermal Resistance Capacitance12AC Test Loads and Waveforms Parameter Description Test Conditions Tqfp 119 BGA Unit Max Switching Characteristics Over the Operating Range17 Read/Write Timing19, 20 Switching WaveformsCEN Address A1 A2 NOP, STALL, and Deselect Cycles19, 20 ZZ Mode Timing23 Ordering Information Pin Tqfp 14 x 20 x 1.4 mm Package Diagrams Ball BGA 14 x 22 x 2.4 mm Document History Issue Orig. Description of Change Date