CY7C1352G
Document #: 38-05514 Rev. *D Page 7 of 12
ISB4 Automatic CE
Power-down
Current—TTL Inputs
VDD = Max, Device Deselected,
VIN ≥ VIH or VIN ≤ VIL, f = 0 All speeds 45 mA
Capacitance[11]
Parameter Description Test Conditions 100 TQFP
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V,
VDDQ = 3.3V
5pF
CCLK Clock Input Capacitance 5 pF
CI/O Input/Output Capacitance 5 pF
Thermal Resistance[11]
Parameter Description Test Conditions 100 TQFP
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51.
30.32 °C/W
ΘJC Thermal Resistance
(Junction to Case) 6.85 °C/W

AC Test Loads and Waveforms

Note:
11.Tested initially and after any design or process changes that may affect these parameters.
Electrical Characteristics Over the Operating Range[9, 10] (continued)
Parameter Description Test Conditions Min. Max. Unit
1ns
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
T
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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