CY7C1354CV25
CY7C1356CV25
Document #: 38-05537 Rev. *H Page 17 of 28
Capacitance[16]
Parameter Description Test Conditions 100 TQFP
Max. 119 BGA
Max. 165 FBGA
Max. Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 2.5V, VDDQ = 2.5V 555pF
CCLK Clock Input Capacitance 5 5 5 pF
CI/O Input/Output Capacitance 5 7 7 pF
Thermal Resistance[16]
Parameters Description Test Conditions 100 TQFP
Package 119 BGA
Package 165 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to
Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
29.41 34.1 16.8 °C/W
ΘJC Thermal Resistance
(Junction to Case) 6.13 14 3.0 °C/W
AC Test Loads and Waveforms
Note:
16.Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT = 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
2.5V I/O Test Load
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