CY7C1354CV25

CY7C1356CV25

Maximum Ratings

(Above which the useful life may be impaired. For user guide- lines, not tested.)

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +3.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC to Outputs in Tri-State

–0.5V to VDDQ + 0.5V

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

20 mA

Static Discharge Voltage

> 2001V

(per MIL-STD-883, Method 3015)

 

Latch-up Current

> 200 mA

Operating Range

Range

Ambient Temperature

VDD/VDDQ

Commercial

0°C to +70°C

2.5V ±5%

Industrial

–40°C to +85°C

 

Electrical Characteristics Over the Operating Range[14, 15]

Parameter

Description

Test Conditions

Min.

Max.

Unit

VDD

Power Supply Voltage

 

 

2.375

2.625

V

VDDQ

I/O Supply Voltage

for 2.5V I/O

 

2.375

VDD

V

VOH

Output HIGH Voltage

for 2.5V I/O, IOH = 1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 2.5V I/O, IOL= 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage

for 2.5V I/O

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[14]

for 2.5V I/O

 

–0.3

0.7

V

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

A

 

except ZZ and MODE

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

Input = VDD

 

 

5

A

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

–5

5

A

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

4-ns cycle, 250 MHz

 

250

mA

 

 

f = fMAX = 1/tCYC

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

220

mA

 

 

 

6-ns cycle, 166 MHz

 

180

mA

 

 

 

 

 

 

 

ISB1

Automatic CE

Max. VDD, Device Deselected,

4-ns cycle, 250 MHz

 

130

mA

 

Power-down

VIN VIH or VIN VIL, f = fMAX =

 

 

 

 

 

5-ns cycle, 200 MHz

 

120

mA

 

Current—TTL Inputs

1/tCYC

 

 

 

 

 

6-ns cycle, 166 MHz

 

110

mA

 

 

 

 

 

 

 

 

 

 

 

ISB2

Automatic CE

Max. VDD, Device Deselected,

All speed grades

 

40

mA

 

Power-down

VIN 0.3V or VIN > VDDQ 0.3V,

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

ISB3

Automatic CE

Max. VDD, Device Deselected,

4-ns cycle, 250 MHz

 

120

mA

 

Power-down

VIN 0.3V or VIN > VDDQ 0.3V,

 

 

 

 

 

5-ns cycle, 200 MHz

 

110

mA

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

6-ns cycle, 166 MHz

 

100

mA

 

 

 

 

 

 

 

 

 

 

 

ISB4

Automatic CE

Max. VDD, Device Deselected,

All speed grades

 

40

mA

 

Power-down

VIN VIH or VIN VIL, f = 0

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

Notes:

14.Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC)> –2V (Pulse width less than tCYC/2).

15.TPower-up: Assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document #: 38-05537 Rev. *H

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Cypress CY7C1356CV25, CY7C1354CV25 manual Maximum Ratings, Electrical Characteristics Over the Operating Range14

CY7C1356CV25, CY7C1354CV25 specifications

The Cypress CY7C1354CV25 and CY7C1356CV25 are high-performance, synchronous SRAM (Static Random Access Memory) devices designed for bandwidth-intensive applications. Both components are part of the Cypress family of low-power high-speed SRAMs, making them ideal for use in networking, telecommunications, and high-speed data processing systems.

One of the main features of the CY7C1354CV25 and CY7C1356CV25 is their wide data bus. The CY7C1354CV25 provides a 4 Megabit memory capacity with a 36-bit wide data interface, while the CY7C1356CV25 boosts this to 6 Megabits with a similarly wide data interface. This allows for high data throughput and efficiency in applications where quick access to large data sets is critical.

Both devices offer asynchronous write and synchronous read capabilities, enabling them to support pipelines and burst accesses effectively. The memory can be accessed in a single cycle, which considerably enhances performance in applications that require quick response times, such as high-speed packet processing in routers and switches.

The Cypress SRAMs are built using advanced CMOS technology, enabling low power consumption, which is essential for mobile and battery-operated devices. Their operating voltage range, typically between 2.7V and 3.6V, contributes to the low power profile while providing a high level of performance.

Moreover, both devices support a wide temperature range, making them suitable for industrial applications. They can operate in environments from -40°C to +125°C, ensuring reliability and performance under varying conditions. This makes the CY7C1354CV25 and CY7C1356CV25 particularly valuable for automotive and aerospace applications where temperature extremes can be encountered.

Cypress has enhanced the reliability of these SRAMs with features such as built-in error detection and correction capabilities. This ensures data integrity, which is crucial for mission-critical applications.

In summary, the Cypress CY7C1354CV25 and CY7C1356CV25 ensure tight integration of high capacity, speed, and reliability. With their advanced synchronous architecture, low power consumption, and broad temperature range, they represent an excellent choice for applications that demand high performance in challenging environments. These SRAM devices continue to meet the needs of modern electronic designs, making them a trusted solution in the industry.