Manuals / DFI / Computer Equipment / Computer Hardware

DFI PM12-EL, PM12-EC Dram Timing, Sdram CAS Latency, Bank Interleave, Precharge to Active Trp

Models: PM12-EC PM12-EL

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3Award BIOS Setup Utility

DRAM Timing

This field is used to select the timing of the DRAM.

By SPD The EEPROM on a DIMM has SPD (Serial Presence Detect) data structure that stores information about the module such as the memory type, memory size, memory speed, etc. When this option is selected, the system will run according to the information in the EEPROM. This option is the default setting because it provides the most stable condition for the system. The “SDRAM CAS Latency” to “DRAM Command Rate” fields will show the default settings by SPD.

Manual If you want a better performance for your system other than the one “by SPD”, select “Manual”. Then select the best option in the “SDRAM CAS Latency” to “DRAM Command Rate” fields.

SDRAM CAS Latency

The default setting is 3 which is 3 clock cycles for the CAS latency.

Bank Interleave

The options are 2 Bank, 4 Bank and Disabled.

Precharge to Active (Trp)

The options are 2T and 3T.

Active to Precharge (Tras)

The options are 5T and 6T.

Active to CMD (Trcd)

The options are 2T and 3T.

DRAM Command Rate

The options are 1T Command and 2T Command.

DRAM Burst Len

The options are 4 and 8.

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DFI PM12-EL, PM12-EC Dram Timing, Sdram CAS Latency, Bank Interleave, Precharge to Active Trp, Active to Precharge Tras
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PM12-EC, PM12-EL specifications

The DFI PM12-EL and PM12-EC are advanced industrial motherboards designed for versatile applications in demanding environments. These motherboards reflect DFI's commitment to quality and innovation, making them a preferred choice for various sectors such as automation, transportation, and embedded systems.

One of the standout features of the PM12-EL and PM12-EC is their support for Intel's 8th generation Core processors. This allows for exceptional performance in processing tasks, enhanced multitasking capabilities, and improved power efficiency. The integration of Intel technology ensures that these motherboards can handle intensive workloads, making them ideal for embedded applications requiring significant computational power.

In terms of connectivity, both models are equipped with multiple I/O options. They include a variety of USB ports, HDMI, and LVDS outputs, enabling seamless integration with various peripherals and devices. Additionally, they come with multiple Ethernet ports, facilitating high-speed networking crucial for real-time data processing and communication in industrial environments.

The DFI PM12-EL and PM12-EC boast robust build quality designed for durability. Their thermal management capabilities are particularly noteworthy, utilizing advanced heat dissipation technologies to maintain optimal operating temperatures. This becomes essential in scenarios where the system may be exposed to extreme conditions, ensuring reliability and longevity.

Another critical characteristic of these motherboards is their support for extended temperature ranges, making them suitable for use in harsh environments. This feature, combined with their sturdy design, ensures that the PM12 series can function effectively in various applications, from outdoor installations to factory floors.

The PM12-EL focuses on embedded applications and provides features like software configurable BIOS settings and a multitude of expansion slots for added functionality. On the other hand, the PM12-EC is tailored more toward IoT applications with enhanced wireless connectivity options, making them ideal for modern smart network setups.

Overall, the DFI PM12-EL and PM12-EC represent a fusion of cutting-edge technology, rugged design, and extensive connectivity features. They empower industries to adopt advanced computing solutions that can withstand rigorous demands while delivering outstanding performance. As industries increasingly move towards automation and the Internet of Things, DFI’s motherboards emerge as reliable foundations for developing innovative applications.