Emerson 6420FE Machine, Masking Flat Pack-IC Tape Tweezers, With Soldering Iron, With Iron Wire

3.The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when remov- ing it.

	Hot-air
	Flat Pack-IC
	Desoldering
CBA	Machine
Masking	Flat Pack-IC
Tape
Tweezers
	Fig. S-1-2

With Soldering Iron:

(1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)

Flat Pack-IC Desoldering Braid

Soldering Iron

Fig. S-1-3

(2)Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering ma- chine.(Fig. S-1-4)

Sharp

Pin

Fine Tip

Soldering Iron

Fig. S-1-4

(3)Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)

(4)Release the flat pack-IC from the CBA using twee- zers. (Fig. S-1-6)

With Iron Wire:

(1)Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)

(2)Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.

(3)While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA con- tact pads as shown in Fig. S-1-5.

3-2 L14STA