FOCUS Enhancements FS453, FS454, FS455, FS456 7. Specifications

FS453/4 AND FS455/6 DATA SHEET: HARDWARE REFERENCE

7. Specifications

7.1 Absolute Maximum and Recommended Ratings

(Beyond which the device may be damaged)(a)

Parameter Min Rec. Max Unit

Power Supply Voltages

VDD-33 (Measured to VSS_33) -0.3 3.0-3.6 3.8 V

VDD-18 (Measured to VSS_18) -0.3 1.62-1.95 2.4 V

VDD-DAD (Measured to VSS_DAD) -0.3 3.0-3.6 3.8 V

VDD-PA (Measured to VSS_PA) -0.3 3.0-3.6 3.8 V

VDD-DA (Measured to VSS_DA) -0.3 3.0-3.6 3.8 V

VDD-O (Measured to VSS_O) -0.3 3.0-3.6 3.8 V

VDD-OSC (Measured to VSS_OSC) -0.3 3.0-3.6 3.8 V

VSS-DA, VSS-DAD, VSS-PA, VSS-33, VSS-18, VSS-O, VSS-OSC (delta) -0.3 0.3 V

Digital Inputs

3.3 V logic applied voltage (Measured to VSS_33)(b) -0.3 0-VDD-33 VDD-33 + 0.3 V

5V Tolerant (TTL) logic applied voltage -0.3 3.0-5.5 6.5 V

Forced current (c,d) -10.0 10.0 mA

Analog Outputs

Applied Voltage (Measured to VSS_DA)(b) -0.3 0-VDD-DA VDD-DA + 0.3 V

Forced current (c,d) -10.0 10.0 mA

Digital Outputs

3.3 V logic applied voltage (Measured to VSS_33)(b) -0.3 0-VDD-33 VDD-33 + 0.3 V

5V Tolerant (TTL) logic applied voltage -0.3 3.0-3.6 3.8 V

Forced current (c,d) -6.0 6.0 mA

Short circuit duration (single output in HIGH state to

ground) 1 second

Temperature

Operating, Ambient 0 70 °C

Junction 125 °C

Case Temperature 95 °C

Lead Soldering (10 seconds) 300 °C

Vapor Phase Soldering (1 minute)(a) 220 °C

Storage(a) -40 125 °C

Electrostatic

Electrostatic Discharge(e) ±150 V

Notes:

(a) Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed

only if operating within recommended ratings.

(b) Applied voltage must be current limited to specified range.

(c) Forcing voltage must be limited to specified range.

(d) Current is specified as conventional current flowing into the device.

(e) EIAJ test method.

Table 6: Absolute Maximum and Recommended Ratings

JANUARY, 2005, VERSION 3.0 24 COPYRIGHT ©2003-4 FOCUS ENHANCEMENTS, INC.

FOCUS Enhancements Semiconductor

Contents

Main FS453/4 and FS455/6 PC-to-TV Video Scan Converter Data Sheet Guides ; The FS453/4 and FS455/6 Hardware Reference is for The FS453/4 and FS455/6 Software/Firmware Reference is for programmers. Table of Contents, Figures & Tables Document Overview 1. Introduction 1.1 General Description 1.2 How does it work? 1.2.1 SDTV Output 1.2.2 HDTV Output 2. Architectural Overview 2.1 Inputs 2.1.1 Input to Output Conversion Matrix 2.2 Color Space Converter 2.3 Patented 2D Scaler 2.4 Patented 2D Flicker Filter 2.5 FIFO 2.6 Post (Horizontal Up) Scaler 2.7 Encoder and Inverse Color Space 2.8 Bi and Tri-Level Sync Insertion (HDTV) 2.12 Serial Control Interface 2.13 Sync Timing Generator 2.14 Input Synchronization 3. Technical Highlights 3.1 Scaling 3.1.1 Video Scaler Challenges 3.1.2 FS453 Solution 3.2 Flicker Reduction 3.2.1 Flicker Filter Challenges 3.2.2 FS453 Solution 3.3 Video Encoding 3.3.1 Encoding Challenges 3.3.2 FS453 Solution 4. Scaling and Positioning Notes 4.1 Vertical Scaling Figure 5: VTOTAL and VACTIVE ratios must match 4.2 Horizontal Scaling 4.3 Vertical and Horizontal Position 5. Pin Assignments Pin Name Pin Name Pin Name Pin Name FS455/6 88 FBGA Bottom View Figure 8 FBGA Pin Diagram 5.1 FS453 GCC Pin Mapping 5.2 Pin Descriptions Page Page Page 6. Control Register Function Map 6.1 Register Reference Table Page Page 7. Specifications 7.1 Absolute Maximum and Recommended Ratings 7.2 Electrical Characteristics Page 7.3 Switching Characteristics 8. Mechanical Dimensions 8.1 80-Lead PQFP Package Page 9. Component Placement 9.1 Power/Ground 9.1.1 Power 9.1.2 Ground 9.2 DIGITAL SIGNALS 9.2.1 Digital Signal Routing 9.2.2 Video Inputs 9.3 ANALOG SIGNALS 9.3.1 Video Output Filters Page 9.4 CLOCK/OSCILLATOR 9.4.1 Reference Crystal Oscillator 9.4.2 FS453 Pixel Clock 9.4.3 Pixel Clock Mode GCC FS453 GCC 9.5 EMI Case Study 9.6 Solder Re-flow Profiles -flow Profile IR Re- IR Re IR Re -flow Profile IR Re- flow Profile 10. Revision History 11. Order Information Critical Applications Policy FOCUS Enhancements, Inc.