FOCUS Enhancements FS453, FS454, FS455, FS456 IR Re, -flow Profile, IR Re-, flow Profile, IR Re-flow Profile & Moisture Absorption Condition

FS453/4 AND FS455/6 DATA SHEET: HARDWARE REFERENCE
6°C/sec max.
Max. 220 +5, -0 °C
10sec ±3sec
60~150sec
(Over 183°C)
3°C/sec Max.
140~160°C
60~120sec
3°C/sec Max.Max. 225°C
Cooling down(F)Re-flow peak (E)Maintain(D)Heat-up(C)Pre-heat(B)Heat-up(A)Peak Temp.
IR Re-flow Profile for Pre-conditioning
100
200
300
°C
B
C
D
E (Peak Temperature 220°C +5, -0 °C)
A
F
sec
IR Re
IR Re- -flow Profile flow Profile
Figure 16 FBGA Package (Lead Solder)

Moisture Absorption Condition : 30 Moisture Absorption Condition : 30°C/60%RH, 192hrs C/60%RH, 192hrs

IR sequence : Bake IR sequence : Bake - -Absorption Absorption - -IR 3 times IR 3 times
IR Re-flow Profile & Moisture Absorption Condition
100
200
300°C
B
CD
E (Peak Temperature 260°C)
A
F
sec
6°C/sec Max.Max. 260°C
255°C+5, -0°C
10 ±3sec
3°C/sec Max.
160~190°C
90 ±30sec
3°C/sec Max.Max. 260°C
Cooling down(F)Re-flow peak (E)Maintain (D)Heat-up(C)Pre-heat(B)Heat-up(A)Peak Temp.
IR Re-flow Profile for Pre-conditioning
Figure 17 PQFP or FBGA Package (Lead-Free Solder)
JANUARY, 2005, VERSION 3.0 39 COPYRIGHT ©2003-4 FOCUS ENHANCEMENTS, INC.
FOCUS Enhancements Semiconductor