FS453/4 AND FS455/6 DATA SHEET: HARDWARE REFERENCE
9.6 Solder Re-flow Profiles

The following figures provide solder re-flow profiles for the PQFP and FBGA packages with lead and

lead-free solder options.

6°C/sec max.
Max. 235 +5, -0 °C
10sec +/-3sec
20~60sec
(Over 200°C)
3°C/sec Max.
140~160°C
60~120sec
3°C/sec Max.Max. 240°C
Cooling down(F)Re-flow peak(E)Maintain(D)Heat-up(C)Pre-heat(B)Heat-up(A)Peak Temp.
IR Re-flow Profile for Pre-conditioning
100
200
300
°C
B
C
D
E (Peak Temperature 235°C +5, -0 °C)
A
F
sec

IR Re

IR Re-

-flow Profile

flow Profile

Figure 15 PQFP Package (Lead Solder)

JANUARY, 2005, VERSION 3.0 38 COPYRIGHT ©2003-4 FOCUS ENHANCEMENTS, INC.
FOCUS Enhancements Semiconductor