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Fujitsu MBB2147RC, MBB2073RC manual Related Standards

Models: MBB2073RC MBB2147RC

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Related Standards

Related Standards

Product specifications and functions described in this manual comply with the following ANSI (*1) standards and SFF Committee specifications.

Document number	Title

T10/1236D Rev.20	SCSI Primary Commands-2 (SPC-2)
[NCITS.351:2001]

T10/996D Rev. 8c	SCSI-3 Block Commands (SBC)
[NCITS.306:1998]

T10/1157D Rev. 24	SCSI Architecture Model-2 (SAM-2)

T10/1561D Rev. 14	SCSI Architecture Model-3 (SAM-3)

T10/1562D Rev. 05	Serial Attached SCSI (SAS)

T10/1601D Rev. 10	Serial Attached SCSI Model-1.1 (SAS 1.1)

SFF-8201 Rev. 2.4	Form Factor of 2.5" Disk Drives

SFF-8223 Rev. 2.5	2.5" Drive Form Factor with Serial Connector

*1 ANSI = American National Standard Institute

In case of conflict between this manual and any referenced document, this manual takes precedence.

Compliance with Administration on the Control of Pollution Caused by Electronic Information Products of the People's Republic of China

This product is shipped as a component to manufacture the final products. Therefore, the packaging material code provided in GB18455-2001 is not marked on any packaging part of this product.

C141-E257

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Fujitsu MBB2147RC, MBB2073RC manual Related Standards

Contents

MBB2147RC MBB2073RC HARD DISK DRIVES PRODUCT MANUAL C141-E257-02ENHandling of This Manual FOR SAFE OPERATIONIMPORTANT NOTE TO USERS Specification No. C141-E257-**EN REVISION RECORDRelated Standards Chapter 2 Specifications Chapter 4 Installation RequirementsChapter 5 Installation Chapter 6 Diagnostics and MaintenanceCONVENTIONS USED IN THIS MANUAL PrefaceConventions for Alert Messages Important Alert Items High temperatureImportant Alert Messages DamageImportant Alert Items High temperatureData loss Electrical shockMANUAL ORGANIZATION PRODUCT MANUAL This manual SAS INTERFACE MANUAL This page is intentionally left blank Specifications Installation RequirementsCHAPTER General DescriptionInstallation Diagnostics and MaintenanceContents CHAPTERContents Error AnalysisCHAPTER Illustrations Figures ContentsSurface temperature measurement points Recommended external circuit for Ready LED outputContents TablesTable 7.1 Definition of sense data This page is intentionally left blank 1.1 Standard Features 1.2 Hardware Structure 1.3 System Configuration CHAPTER 1 General Description1.1 Standard Features General Description 1.1 Standard Features General Description 16 Large capacity1.2 Hardware Structure 1.2 Hardware Structure1.3 System Configuration General Description1.3 System Configuration This page is intentionally left blank CHAPTER 2 Specifications 2.1 Hardware Specifications2.1 Hardware Specifications 2.1.1 Model name and order number Table 2.1 Model names and order numbers2.1.2 Function specifications SpecificationsFunction specifications 2.1 Hardware Specifications Specifications 2.1.3 Environmental specificationsEnvironmental/Power requirements C141-E2572.1.4 Error rate 2.1 Hardware Specifications2.1.5 Reliability Specifications 2 Mean Time To Repair MTTRCHAPTER 3 Data Format 3.1.1 Cylinder configuration3.1 Data Space 3.2 Logical Data Block Addressing 3.3 Defect ManagementData Format Figure 3.1 Cylinder configuration3.1 Data Space Data Format 3.1.2 Alternate spare areaFigure 3.2 Spare area in cell Figure 3.3 Alternate cylinder3.1.3 Track format 3.1 Data SpaceFigure 3.4 Track format Data Format Figure 3.5 Track skew/head skew3.1.4 Sector format Figure 3.6 Sector format3.1 Data Space Each sector on the track consists of the following fieldsData Format C141-E2573.1.5 Format capacity Format capacity3.2 Logical Data Block Addressing 3.3 Defect Management 3.3.1 Defect list Data Format3.3.2 Alternate block allocation 3.3 Defect Management Figure 3.7 Alternate block allocation by FORMAT UNIT commandFigure 3.8 Alternate block allocation by REASSIGN BLOCKS command Data Format3.3 Defect Management 3 Automatic alternate block allocationType 2 Reassignment of write fail sector 1 Commands to be applied Data FormatCHAPTER 4 Installation Requirements 4.1 Mounting Requirements 4.2 Power Supply Requirements4.1 Mounting Requirements 4.1.1 Dimensions Figure 4.1 Dimensions4.1.2 Mounting orientations Installation RequirementsFigure 4.2 HDD orientations 4.1 Mounting Requirements 4.1.3 Notes on mountingDamage Figure 4.3 Mounting frame structure exampleInstallation Requirements 3 Limitation of side-mountingUse all 4 mounting holds on the both sides 4 Limitation of bottom-mountingFigure 4.5 Surface temperature measurement points Table 4.1 Surface temperature check point and maximum temperature4.1 Mounting Requirements 4.2 Power Supply Requirements Installation RequirementsFigure 4.6 Current waveform Spin-up 4.2 Power Supply Requirements Figure 4.7 Current waveform Max seekInstallation Requirements 4.3.1 Connector locationFigure 4.9 Connector location Figure 4.8 AC noise filter recommended 4.3 Connection Requirements4.3 Connection Requirements 4.3.2 Interface connectorFigure 4.10 SAS plug connector overview S1 S7 P1 Top view P15Installation Requirements Table 4.2 Interface connector SAS plug signal allocationCN14.3.3 Ready LED output signal 4.3.4 Connector requirementsTable 4.3 Recommended connectors 4.3 Connection RequirementsThis page is intentionally left blank CHAPTER 5 Installation 5.1 Notes on Handling HDDs 5.2 Setting 5.3 Mounting HDDsHigh temperature 5.5 Dismounting HDDsInstallation 5.2 Setting 5.2.1 Port Address 5.2 Setting5.3 Mounting HDDs 5.3.1 Mounting procedures 1 Initial diagnosis at the time of power-on Installation5.4.1 Checking initial operation 5.4.2 Formatting Installation 2 FORMAT UNIT command5.4.3 Setting parameters C141-E257 Installationcontinued C141-E257 absolute valueInstallation High temperatureC141-E257 5.5 Dismounting HDDsCHAPTER 6 Diagnostics and Maintenance 6.1 Diagnostics 6.2 Maintenance 6.3 Operation Check6.4 Troubleshooting 6.5 Packaging 6.1 Diagnostics 6.1.1 Self-diagnosticsDiagnostics and Maintenance 6.1 Diagnostics Operation of self-diagnosticsDiagnostics and Maintenance 6.1.2 Test programs6.2 Maintenance 6.2 Maintenance6.2.1 Precautions High temperatureDiagnostics and Maintenance 6.2.2 Maintenance requirements6.2.3 Maintenance levels 6.2 Maintenance6.2.4 Tools and test equipment Diagnostics and Maintenance Operation test See Subsection Diagnostic test See SubsectionFigure 6.1 Test flowchart 6.2.5 Tests6.3 Operation Check 6.3.3 Diagnostic test6.3 Operation Check 6.3.1 Initial seek operation check 6.3.2 Operation test6.4 Troubleshooting 6.4.1 Outline of troubleshooting procedures Diagnostics and Maintenance6.4.2 Troubleshooting with HDD replacement in the field 6.4 Troubleshooting System-level field troubleshootingDiagnostics and Maintenance 6.4.3 Troubleshooting at the repair siteHDD troubleshooting C141-E2576.4.4 Troubleshooting with parts replacement in the factory 6.4 Troubleshooting6.4.5 Finding possibly faulty parts Diagnostics and Maintenance Product From Connector side6.5 Packaging 6.5.1 Bag packaging6.5.2 Box packaging 6.5 PackagingFigure 6.3 Box packaging C141-E257 Diagnostics and MaintenanceFigure 6.4 Fraction packaging CHAPTER 7 Error Analysis 7.1 Sense Data Collection 7.2 Sense Data Analysis7.1 Sense Data Collection 7.1.1 Sense data 7.1.2 Sense data formatError Analysis Figure 7.1 Sense data format7.2 Sense Data Analysis 7.2.1 Error information indicated with sense data7.2 Sense Data Analysis Definition of sense dataError Analysis 7.2.3 Sense data 1-1x-xx, 3-1x-xx and E-1D-00 Disk read errorC141-E257 7.2.2 Sense data 3-0C-03, 4-32-01, 4-40-xx, 4-C4-xx, andCommand GlossaryAdditional Sense Code InitiatorThis page is intentionally left blank Acronyms and Abbreviations Acronyms and Abbreviations Index Index Index storageThis page is intentionally left blank Comment Form This page is intentionally left blank