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Fujitsu MBB2073RC manual Connection Requirements, Ready LED output signal, Connector requirements

Models: MBB2073RC MBB2147RC

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4.3 Connection Requirements

4.3.3Ready LED output signal

Figure 4.11 shows a recommended circuit for external LED connection to Ready LED output signal.

Figure 4.11 Recommended external circuit for Ready LED output

Either +3.3 V or +5 V can be used for external power supply for LED (Vcc). Current limiting resister (R) value need to be adjusted depend on the Vcc voltage. For +3.3 V Vcc voltage, recommended resistance is 220 Ω . For +5 V Vcc voltage, recommended resistance is 330 Ω .

4.3.4Connector requirements

Table 4.3 lists the recommended connectors for the host system.

Table 4.3 Recommended connectors

Manufacture	Part number	Remarks

Tyco Electronics AMP	1735104-1	Hybrid (SMT/Dip) type

	1735105-1	SMT type

	1735164-1	Press Fit Type

	1735234-1	Press Fit Type

Fujikura	SAS-RA29-S1AA-FG	Virtical SMT with Tab

	SAS-RC29-S1AA-FG	Virtical SMT with Lock pin

	SAS-RC29-S1AB-FG	Virtical SMT with Lock pin

C141-E257

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Fujitsu MBB2073RC Connection Requirements, Ready LED output signal, 11 Recommended external circuit for Ready LED output

Contents

C141-E257-02EN MBB2147RC MBB2073RC HARD DISK DRIVES PRODUCT MANUALHandling of This Manual FOR SAFE OPERATIONIMPORTANT NOTE TO USERS REVISION RECORD Specification No. C141-E257-**ENRelated Standards Chapter 6 Diagnostics and Maintenance Chapter 2 SpecificationsChapter 4 Installation Requirements Chapter 5 InstallationCONVENTIONS USED IN THIS MANUAL PrefaceConventions for Alert Messages Damage Important Alert ItemsHigh temperature Important Alert MessagesElectrical shock Important Alert ItemsHigh temperature Data lossMANUAL ORGANIZATION PRODUCT MANUAL This manual SAS INTERFACE MANUAL This page is intentionally left blank General Description SpecificationsInstallation Requirements CHAPTERCHAPTER InstallationDiagnostics and Maintenance ContentsContents Error AnalysisCHAPTER Recommended external circuit for Ready LED output Illustrations FiguresContents Surface temperature measurement pointsContents TablesTable 7.1 Definition of sense data This page is intentionally left blank 1.1 Standard Features 1.2 Hardware Structure 1.3 System Configuration CHAPTER 1 General Description1.1 Standard Features General Description 1.1 Standard Features 16 Large capacity General Description1.2 Hardware Structure 1.2 Hardware StructureGeneral Description 1.3 System Configuration1.3 System Configuration This page is intentionally left blank Table 2.1 Model names and order numbers CHAPTER 2 Specifications2.1 Hardware Specifications 2.1 Hardware Specifications 2.1.1 Model name and order number2.1.2 Function specifications SpecificationsFunction specifications 2.1 Hardware Specifications C141-E257 Specifications2.1.3 Environmental specifications Environmental/Power requirements2.1.4 Error rate 2.1 Hardware Specifications2.1.5 Reliability 2 Mean Time To Repair MTTR Specifications3.3 Defect Management CHAPTER 3 Data Format3.1.1 Cylinder configuration 3.1 Data Space 3.2 Logical Data Block AddressingFigure 3.1 Cylinder configuration Data Format3.1 Data Space Figure 3.3 Alternate cylinder Data Format3.1.2 Alternate spare area Figure 3.2 Spare area in cell3.1.3 Track format 3.1 Data SpaceFigure 3.4 Track format Figure 3.6 Sector format Data FormatFigure 3.5 Track skew/head skew 3.1.4 Sector formatEach sector on the track consists of the following fields 3.1 Data SpaceFormat capacity Data FormatC141-E257 3.1.5 Format capacity3.2 Logical Data Block Addressing 3.3 Defect Management 3.3.1 Defect list Data Format3.3.2 Alternate block allocation Figure 3.7 Alternate block allocation by FORMAT UNIT command 3.3 Defect ManagementData Format Figure 3.8 Alternate block allocation by REASSIGN BLOCKS command3 Automatic alternate block allocation 3.3 Defect ManagementData Format Type 2 Reassignment of write fail sector 1 Commands to be appliedFigure 4.1 Dimensions CHAPTER 4 Installation Requirements4.1 Mounting Requirements 4.2 Power Supply Requirements 4.1 Mounting Requirements 4.1.1 Dimensions4.1.2 Mounting orientations Installation RequirementsFigure 4.2 HDD orientations Figure 4.3 Mounting frame structure example 4.1 Mounting Requirements4.1.3 Notes on mounting Damage4 Limitation of bottom-mounting Installation Requirements3 Limitation of side-mounting Use all 4 mounting holds on the both sidesFigure 4.5 Surface temperature measurement points Table 4.1 Surface temperature check point and maximum temperature4.1 Mounting Requirements 4.2 Power Supply Requirements Installation RequirementsFigure 4.6 Current waveform Spin-up Figure 4.7 Current waveform Max seek 4.2 Power Supply RequirementsFigure 4.8 AC noise filter recommended 4.3 Connection Requirements Installation Requirements4.3.1 Connector location Figure 4.9 Connector locationS1 S7 P1 Top view P15 4.3 Connection Requirements4.3.2 Interface connector Figure 4.10 SAS plug connector overviewTable 4.2 Interface connector SAS plug signal allocationCN1 Installation Requirements4.3 Connection Requirements 4.3.3 Ready LED output signal4.3.4 Connector requirements Table 4.3 Recommended connectorsThis page is intentionally left blank 5.5 Dismounting HDDs CHAPTER 5 Installation5.1 Notes on Handling HDDs 5.2 Setting 5.3 Mounting HDDs High temperatureInstallation 5.2 Setting 5.2.1 Port Address 5.2 Setting5.3 Mounting HDDs 5.3.1 Mounting procedures 1 Initial diagnosis at the time of power-on Installation5.4.1 Checking initial operation 5.4.2 Formatting 2 FORMAT UNIT command Installation5.4.3 Setting parameters C141-E257 Installationcontinued absolute value C141-E2575.5 Dismounting HDDs InstallationHigh temperature C141-E2576.1 Diagnostics 6.1.1 Self-diagnostics CHAPTER 6 Diagnostics and Maintenance6.1 Diagnostics 6.2 Maintenance 6.3 Operation Check 6.4 Troubleshooting 6.5 PackagingDiagnostics and Maintenance Operation of self-diagnostics 6.1 Diagnostics6.1.2 Test programs Diagnostics and MaintenanceHigh temperature 6.2 Maintenance6.2 Maintenance 6.2.1 Precautions6.2.2 Maintenance requirements Diagnostics and Maintenance6.2.3 Maintenance levels 6.2 Maintenance6.2.4 Tools and test equipment 6.2.5 Tests Diagnostics and MaintenanceOperation test See Subsection Diagnostic test See Subsection Figure 6.1 Test flowchart6.3.2 Operation test 6.3 Operation Check6.3.3 Diagnostic test 6.3 Operation Check 6.3.1 Initial seek operation check6.4 Troubleshooting 6.4.1 Outline of troubleshooting procedures Diagnostics and Maintenance6.4.2 Troubleshooting with HDD replacement in the field System-level field troubleshooting 6.4 TroubleshootingC141-E257 Diagnostics and Maintenance6.4.3 Troubleshooting at the repair site HDD troubleshooting6.4.4 Troubleshooting with parts replacement in the factory 6.4 Troubleshooting6.4.5 Finding possibly faulty parts 6.5.1 Bag packaging Diagnostics and MaintenanceProduct From Connector side 6.5 Packaging6.5.2 Box packaging 6.5 PackagingFigure 6.3 Box packaging C141-E257 Diagnostics and MaintenanceFigure 6.4 Fraction packaging 7.1.2 Sense data format CHAPTER 7 Error Analysis7.1 Sense Data Collection 7.2 Sense Data Analysis 7.1 Sense Data Collection 7.1.1 Sense dataFigure 7.1 Sense data format Error AnalysisDefinition of sense data 7.2 Sense Data Analysis7.2.1 Error information indicated with sense data 7.2 Sense Data Analysis7.2.2 Sense data 3-0C-03, 4-32-01, 4-40-xx, 4-C4-xx, and Error Analysis7.2.3 Sense data 1-1x-xx, 3-1x-xx and E-1D-00 Disk read error C141-E257Initiator CommandGlossary Additional Sense CodeThis page is intentionally left blank Acronyms and Abbreviations Acronyms and Abbreviations Index Index storage IndexThis page is intentionally left blank Comment Form This page is intentionally left blank