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Fujitsu MBB2147RC Important Alert Items, Data loss, High temperature, Electrical shock, Damage

Models: MBB2073RC MBB2147RC

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Important Alert Items

Important Alert Items

	Task	Alert message	Page

	Diagnostics	Data loss
	and	Save data stored on the HDD to other media before requesting repair.	67
	Maintenance		67
	Maintenance	Fujitsu does not assume responsibility if data is corrupted during servicing

		or repair.
		High temperature
		To prevent injury, never touch the HDD while it is hot. The DE and LSI	67
		become hot during operation and remain hot immediately after turning off
		the power.
		Electrical shock
		Never touch the HDDs while power-feeding.	67
		Damage
		• Always ground yourself with a wrist strap connected to ground before	67
		handling. ESD (Electrostatics Discharge) may cause the damage to the
		device.
		• Never use a conductive cleaner to clean the HDDs.
		• Never remove any labels from the HDD or deface them in any way.
		• Never remove the PCBA.
		• Never open the HDD for any reason.
		Damage
		• Never remove any labels from the HDD or deface them in any way.	74
		• Never open the HDD for any reason. Doing so will void any
		warranties.

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C141-E257

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Fujitsu MBB2147RC, MBB2073RC manual Important Alert Items, Data loss, High temperature, Electrical shock, Damage

Contents

MBB2147RC MBB2073RC HARD DISK DRIVES PRODUCT MANUAL C141-E257-02ENIMPORTANT NOTE TO USERS FOR SAFE OPERATIONHandling of This Manual Specification No. C141-E257-**EN REVISION RECORDRelated Standards Chapter 2 Specifications Chapter 4 Installation RequirementsChapter 5 Installation Chapter 6 Diagnostics and MaintenanceConventions for Alert Messages PrefaceCONVENTIONS USED IN THIS MANUAL Important Alert Items High temperatureImportant Alert Messages DamageImportant Alert Items High temperatureData loss Electrical shockMANUAL ORGANIZATION PRODUCT MANUAL This manual SAS INTERFACE MANUAL This page is intentionally left blank Specifications Installation RequirementsCHAPTER General DescriptionInstallation Diagnostics and MaintenanceContents CHAPTERCHAPTER Error AnalysisContents Illustrations Figures ContentsSurface temperature measurement points Recommended external circuit for Ready LED outputTable 7.1 Definition of sense data TablesContents This page is intentionally left blank 1.1 Standard Features CHAPTER 1 General Description1.1 Standard Features 1.2 Hardware Structure 1.3 System Configuration General Description 1.1 Standard Features General Description 16 Large capacity1.2 Hardware Structure 1.2 Hardware Structure1.3 System Configuration General Description1.3 System Configuration This page is intentionally left blank CHAPTER 2 Specifications 2.1 Hardware Specifications2.1 Hardware Specifications 2.1.1 Model name and order number Table 2.1 Model names and order numbersFunction specifications Specifications2.1.2 Function specifications 2.1 Hardware Specifications Specifications 2.1.3 Environmental specificationsEnvironmental/Power requirements C141-E2572.1.5 Reliability 2.1 Hardware Specifications2.1.4 Error rate Specifications 2 Mean Time To Repair MTTRCHAPTER 3 Data Format 3.1.1 Cylinder configuration3.1 Data Space 3.2 Logical Data Block Addressing 3.3 Defect ManagementData Format Figure 3.1 Cylinder configuration3.1 Data Space Data Format 3.1.2 Alternate spare areaFigure 3.2 Spare area in cell Figure 3.3 Alternate cylinderFigure 3.4 Track format 3.1 Data Space3.1.3 Track format Data Format Figure 3.5 Track skew/head skew3.1.4 Sector format Figure 3.6 Sector format3.1 Data Space Each sector on the track consists of the following fieldsData Format C141-E2573.1.5 Format capacity Format capacity3.2 Logical Data Block Addressing 3.3.2 Alternate block allocation Data Format3.3 Defect Management 3.3.1 Defect list 3.3 Defect Management Figure 3.7 Alternate block allocation by FORMAT UNIT commandFigure 3.8 Alternate block allocation by REASSIGN BLOCKS command Data Format3.3 Defect Management 3 Automatic alternate block allocationType 2 Reassignment of write fail sector 1 Commands to be applied Data FormatCHAPTER 4 Installation Requirements 4.1 Mounting Requirements 4.2 Power Supply Requirements4.1 Mounting Requirements 4.1.1 Dimensions Figure 4.1 DimensionsFigure 4.2 HDD orientations Installation Requirements4.1.2 Mounting orientations 4.1 Mounting Requirements 4.1.3 Notes on mountingDamage Figure 4.3 Mounting frame structure exampleInstallation Requirements 3 Limitation of side-mountingUse all 4 mounting holds on the both sides 4 Limitation of bottom-mounting4.1 Mounting Requirements Table 4.1 Surface temperature check point and maximum temperatureFigure 4.5 Surface temperature measurement points Figure 4.6 Current waveform Spin-up Installation Requirements4.2 Power Supply Requirements 4.2 Power Supply Requirements Figure 4.7 Current waveform Max seekInstallation Requirements 4.3.1 Connector locationFigure 4.9 Connector location Figure 4.8 AC noise filter recommended 4.3 Connection Requirements4.3 Connection Requirements 4.3.2 Interface connectorFigure 4.10 SAS plug connector overview S1 S7 P1 Top view P15Installation Requirements Table 4.2 Interface connector SAS plug signal allocationCN14.3.3 Ready LED output signal 4.3.4 Connector requirementsTable 4.3 Recommended connectors 4.3 Connection RequirementsThis page is intentionally left blank CHAPTER 5 Installation 5.1 Notes on Handling HDDs 5.2 Setting 5.3 Mounting HDDsHigh temperature 5.5 Dismounting HDDsInstallation 5.3 Mounting HDDs 5.3.1 Mounting procedures 5.2 Setting5.2 Setting 5.2.1 Port Address 5.4.1 Checking initial operation Installation1 Initial diagnosis at the time of power-on 5.4.2 Formatting Installation 2 FORMAT UNIT command5.4.3 Setting parameters continued InstallationC141-E257 C141-E257 absolute valueInstallation High temperatureC141-E257 5.5 Dismounting HDDsCHAPTER 6 Diagnostics and Maintenance 6.1 Diagnostics 6.2 Maintenance 6.3 Operation Check6.4 Troubleshooting 6.5 Packaging 6.1 Diagnostics 6.1.1 Self-diagnosticsDiagnostics and Maintenance 6.1 Diagnostics Operation of self-diagnosticsDiagnostics and Maintenance 6.1.2 Test programs6.2 Maintenance 6.2 Maintenance6.2.1 Precautions High temperatureDiagnostics and Maintenance 6.2.2 Maintenance requirements6.2.4 Tools and test equipment 6.2 Maintenance6.2.3 Maintenance levels Diagnostics and Maintenance Operation test See Subsection Diagnostic test See SubsectionFigure 6.1 Test flowchart 6.2.5 Tests6.3 Operation Check 6.3.3 Diagnostic test6.3 Operation Check 6.3.1 Initial seek operation check 6.3.2 Operation test6.4.2 Troubleshooting with HDD replacement in the field Diagnostics and Maintenance6.4 Troubleshooting 6.4.1 Outline of troubleshooting procedures 6.4 Troubleshooting System-level field troubleshootingDiagnostics and Maintenance 6.4.3 Troubleshooting at the repair siteHDD troubleshooting C141-E2576.4.5 Finding possibly faulty parts 6.4 Troubleshooting6.4.4 Troubleshooting with parts replacement in the factory Diagnostics and Maintenance Product From Connector side6.5 Packaging 6.5.1 Bag packagingFigure 6.3 Box packaging 6.5 Packaging6.5.2 Box packaging Figure 6.4 Fraction packaging Diagnostics and MaintenanceC141-E257 CHAPTER 7 Error Analysis 7.1 Sense Data Collection 7.2 Sense Data Analysis7.1 Sense Data Collection 7.1.1 Sense data 7.1.2 Sense data formatError Analysis Figure 7.1 Sense data format7.2 Sense Data Analysis 7.2.1 Error information indicated with sense data7.2 Sense Data Analysis Definition of sense dataError Analysis 7.2.3 Sense data 1-1x-xx, 3-1x-xx and E-1D-00 Disk read errorC141-E257 7.2.2 Sense data 3-0C-03, 4-32-01, 4-40-xx, 4-C4-xx, andCommand GlossaryAdditional Sense Code InitiatorThis page is intentionally left blank Acronyms and Abbreviations Acronyms and Abbreviations Index Index Index storageThis page is intentionally left blank Comment Form This page is intentionally left blank