2.Remove the heat sink assembly (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach the assembly.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board each time the heat sink assembly is removed. Thermal paste is used on the processor (1), and thermal tape is used on the Northbridge chip (2). Replacement thermal material is included with all heat sink assembly and system board spare part kits.
Reverse this procedure to install the heat sink assembly.
60 Chapter 4 Removal and replacement procedures