3.Remove the fan/heat sink assembly (2).
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1) and the processor (2) each time the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled.
The following locations require thermal pads on systems with discrete graphics subsystems:
●(3) Four locations on heat sink
●(4) Northbridge chip
●(5) NVIDIA video chip
●(6) Capacitors
NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board, and processor spare part kits.
The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1) and the processor (2) each time the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled.
Component replacement procedures 83
