HP D1E80UA, 2000 manual Removal and replacement procedures

Models: 2000

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78 Chapter 4 Removal and replacement procedures

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it

Manual backgroundManual backgroundManual backgroundManual background NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it

Manual backgroundManual backgroundManual backgroundManual background NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory.

78 Chapter 4 Removal and replacement procedures

Page 86
Image 86
HP D1E80UA, 2000 manual Removal and replacement procedures