HP 2000, D1E80UA manual Component replacement procedures

Models: 2000

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Manual background

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it

Manual backgroundManual backgroundManual backgroundManual background NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Celeron processor.

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it Reverse this procedure to reassemble and install the fan/heat sink assembly.

Component replacement procedures 79

Page 87
Image 87
HP 2000, D1E80UA manual Component replacement procedures