Technical Reference
Table 19 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.
Table 19. Thermal Considerations for Components
Component | Maximum Case Temperature |
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|
Processor | For processor case temperature, see processor datasheets and |
| processor specification updates |
|
|
Intel QS77 Express Chipset | 104 oC |
To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 20. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature.
It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol.
Table 20. Tcontrol Values for Components
Component | Tcontrol |
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|
Processor | For processor case temperature, see processor datasheets and |
| processor specification updates |
|
|
Intel QS77 Express Chipset | 104 oC |
For information about | Refer to |
Processor datasheets and specification updates | Section 1.2, page 18 |
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Intel® 7 Series Chipset Thermal Mechanical Specifications and | http://www.intel.com/Products/Desktop/ |
Design Guidelines | |
| technicaldocuments.htm |
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