Datasheet, Volume 1 3
Contents1Introduction..............................................................................................................9
1.1 Processor Feature Details...................................................................................11
1.1.1 Supported Technologies..........................................................................11
1.2 Interfaces ........................................................................................................11
1.2.1 System Memory Support.........................................................................11
1.2.2 PCI Express*.........................................................................................12
1.2.3 Direct Media Interface (DMI)....................................................................14
1.2.4 Platform Environment Control Interface (PECI)...........................................14
1.2.5 Processor Graphics.................................................................................14
1.2.6 Intel® Flexible Display Interface (Intel® FDI)............................................. 15
1.3 Power Management Support...............................................................................15
1.3.1 Processor Core.......................................................................................15
1.3.2 System.................................................................................................15
1.3.3 Memory Controller..................................................................................15
1.3.4 PCI Express*.........................................................................................16
1.3.5 Direct Media Interface (DMI)....................................................................16
1.3.6 Processor Graphics Controller (GT)........................................................... 16
1.3.7 Thermal Management Support................................................................. 16
1.4 Processor SKU Definitions...................................................................................16
1.5 Package...........................................................................................................17
1.6 Processor Compatibility...................................................................................... 18
1.7 Terminology ..................................................................................................... 19
1.8 Related Documents ........................................................................................... 22
2Interfaces................................................................................................................23
2.1 System Memory Interface ..................................................................................23
2.1.1 System Memory Technology Supported.....................................................23
2.1.2 System Memory Timing Support...............................................................24
2.1.3 System Memory Organization Modes.........................................................25
2.1.3.1 Single-Channel Mode.......................................... .. ..................... 25
2.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode........... 25
2.1.4 Rules for Populating Memory Slots............................................................26
2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)..........27
2.1.5.1 Just-in-Time Command Scheduling.................................... .. .. .. .... 27
2.1.5.2 Command Overlap....................................................................27
2.1.5.3 Out-of-Order Scheduling............................................................27
2.1.6 Data Scrambling .................................................................................... 27
2.1.7 DDR3 Reference Voltage Generation......................................................... 27
2.2 PCI Express* Interface....................................................................................... 28
2.2.1 PCI Express* Architecture .......................................................................28
2.2.1.1 Transaction Layer.....................................................................29
2.2.1.2 Data Link Layer........................................................................29
2.2.1.3 Physical Layer..........................................................................29
2.2.2 PCI Express* Configuration Mechanism ..................................................... 30
2.2.3 PCI Express* Port................................................................................... 31
2.2.3.1 PCI Express* Lanes Connection..................................................31
2.3 Direct Media Interface (DMI)............................................................................... 32
2.3.1 DMI Error Flow.......................................................................................32
2.3.2 Processor / PCH Compatibility Assumptions................................................ 32
2.3.3 DMI Link Down ...................................................................................... 32
2.4 Processor Graphics Controller (GT) ...................................................................... 33