Intel BX80637G2010 7

Datasheet, Volume 1 75

Electrical Specifications

7Electrical Specifications

7.1 Power and Ground Lands

The processor has VCC, VDDQ, VCCPLL, VCCSA, VCCAXG, VCCIO and VSS (ground)

inputs for on-chip power distribution. All power lands must be connected to their

respective processor power planes, while all VSS lands must be connected to the

system ground plane. Use of multiple power and ground planes is recommended to

reduce I*R drop. The VCC and VCCAXG lands must be supplied with the voltage

determined by the processor Serial Voltage IDentification (SVID) interface. A new

serial VID interface is implemented on the processor. Table 7-1 specifies the voltage

level for the various VIDs.

7.2 Decoupling Guidelines

Due to its large number of transistors and high internal clock speeds, the processor is

capable of generating large current swings between low- and full-power states. This

may cause voltages on power planes to sag below their minimum values, if bulk

decoupling is not adequate. Larger bulk storage (CBULK), such as electrolytic capacitors,

supply current during longer lasting changes in current demand (for example, coming

out of an idle condition). Similarly, capacitors act as a storage well for current when

entering an idle condition from a running condition. To keep voltages within

specification, output decoupling must be properly designed.

Caution: Design the board to ensure that the voltage provided to the processor remains within

the specifications listed in Tab le 7-4. Failure to do so can result in timing violations or

reduced lifetime of the processor.

7.2.1 Voltage Rail Decoupling

The voltage regulator solution needs to provide:

• bulk capacitance with low effective series resistance (ESR)

• a low interconnect resistance from the regulator to the socket

• bulk decoupling to compensate for large current swings generated during poweron,

or low-power idle state entry/exit

The power delivery solution must ensure that the voltage and current specifications are

met, as defined in Table 7-4.

Contents

Main 2 Contents Page Page Figures Tables Page Revision History 1 Figure 1-1. Desktop Processor Platform DDR3 PECI Intel Processor 1.1 Processor Feature Details 1.1.1 Supported Technologies 1.2 Interfaces 1.2.1 System Memory Support 1.2.2 PCI Express* Page 1.2.3 Direct Media Interface (DMI) 1.2.4 Platform Environment Control Interface (PECI) 1.2.5 Processor Graphics 1.2.6 Intel Flexible Display Interface (Intel FDI) 1.3 Power Management Support 1.3.1 Processor Core 1.3.2 System 1.3.3 Memory Controller 1.3.4 PCI Express* 1.4 Processor SKU Definitions 1.5 Package Introduction 18 Datasheet, Volume 1 1.6 Processor Compatibility PCH Figure 1-2. Desktop Processor Compatibility Diagram VCCIO VR VDDQ VR VCore VR VCCSA VR 1.7 Terminology Table 1-2. Terminology (Sheet 1 of 3) Table 1-2. Terminology (Sheet 2 of 3) Table 1-2. Terminology (Sheet 3 of 3) 1.8 Related Documents Table 1-3. Related Documents 2 2.1 System Memory Interface 2.1.1 System Memory Technology Supported 2.1.2 System Memory Timing Support Table 2-2. Supported UDIMM Module Configurations Table 2-3. Supported SO-DIMM Module Configurations (AIO Only) 2.1.3 System Memory Organization Modes 2.1.3.1 Single-Channel Mode 2.1.3.2 Dual-Channel Mode Intel Flex Memory Technology Mode 2.1.4 Rules for Populating Memory Slots 2.1.5 Technology Enhancements of Intel Fast Memory Access (Intel FMA) 2.1.5.1 Just-in-Time Command Scheduling 2.1.5.2 Command Overlap 2.1.5.3 Out-of-Order Scheduling 2.1.6 Data Scrambling 2.2 PCI Express* Interface 2.2.1 PCI Express* Architecture 2.2.1.1 Transaction Layer 2.2.1.2 Data Link Layer 2.2.1.3 Physical Layer 2.2.2 PCI Express* Configuration Mechanism 2.2.3 PCI Express* Port 2.2.3.1 PCI Express* Lanes Connection 2.3 Direct Media Interface (DMI) 2.3.1 DMI Error Flow 2.3.2 Processor / PCH Compatibility Assumptions 2.3.3 DMI Link Down 2.4 Processor Graphics Controller (GT) 2.4.1 3D and Video Engines for Graphics Processing 2.4.1.1 3D Engine Execution Units 2.4.1.2 3D Pipeline 2.4.1.3 Video Engine 2.4.1.4 2D Engine 2.4.2 Processor Graphics Display 2.4.2.1 Display Planes 2.4.2.2 Display Pipes 2.4.2.3 Display Ports 2.4.3 Intel Flexible Display Interface (Intel FDI) 2.4.4 Multi Graphics Controllers Multi-Monitor Support 2.5 Platform Environment Control Interface (PECI) 2.6 Interface Clocking 2.6.1 Internal Clocking Requirements 3 3.1 Intel Virtualization Technology (Intel VT) 3.1.3 Intel Virtualization Technology (Intel VT) for Directed I/O (Intel VT-d) Objectives 3.1.4 Intel Virtualization Technology (Intel VT) for Directed I/O (Intel VT-d) Features 3.2 Intel Trusted Execution Technology (Intel TXT) 3.3 Intel Hyper-Threading Technology (Intel HT Technology) 3.4 Intel Turbo Boost Technology 3.4.1 Intel Turbo Boost Technology Frequency 3.4.2 Intel Turbo Boost Technology Graphics Frequency 3.5 Intel Advanced Vector Extensions (Intel AVX) 3.6 Security and Cryptography Technologies 3.6.1 Intel Advanced Encryption Standard New Instructions (Intel AES-NI) 3.6.2 PCLMULQDQ Instruction 3.6.3 RDRAND Instruction 3.7 Intel 64 Architecture x2APIC 3.8 Supervisor Mode Execution Protection (SMEP) 3.9 Power Aware Interrupt Routing (PAIR) 4 G0 Working G3 Mechanical Off G1 Sleeping 4.1 Advanced Configuration and Power Interface (ACPI) States Supported The ACPI states supported by the processor are described in this section. 4.1.3 Integrated Memory Controller States 4.1.1 System States 4.1.2 Processor Core / Package Idle States 4.1.4 PCI Express* Link States 4.1.5 Direct Media Interface (DMI) States 4.1.7 Interface State Combinations 4.1.6 Processor Graphics Controller States Table 4-4. PCI Express* Link States 4.2 Processor Core Power Management 4.2.1 Enhanced Intel SpeedStep Technology 4.2.2 Low-Power Idle States Processor Package State Core 0 State C1 C1E C6C3 Core 1 State C0 4.2.3 Requesting Low-Power Idle States 4.2.4 Core C-states 4.2.4.1 Core C0 State 4.2.4.2 Core C1 / C1E State 4.2.4.3 Core C3 State 4.2.4.4 Core C6 State 4.2.4.5 C-State Auto-Demotion 4.2.5 Package C-States 4.2.5.1 Package C0 4.2.5.2 Package C1/C1E 4.2.5.3 Package C3 State 4.2.5.4 Package C6 State 4.3 Integrated Memory Controller (IMC) Power Management 4.3.1 Disabling Unused System Memory Outputs 4.3.2 DRAM Power Management and Initialization 4.3.2.1 Initialization Role of CKE 4.3.2.2 Conditional Self-Refresh 4.3.2.3 Dynamic Power Down Operation 4.3.2.4 DRAM I/O Power Management 4.3.3 DDR Electrical Power Gating (EPG) 4.4 PCI Express* Power Management 4.5 DMI Power Management 4.6 Graphics Power Management 4.6.1 Intel Rapid Memory Power Management (Intel RMPM) (also known as CxSR) 4.6.2 Intel Graphics Performance Modulation Technology (Intel GPMT) 4.7 Graphics Thermal Power Management Page 5 Page 6 6.1 System Memory Interface Signals Table 6-2. Memory Channel A Signals 6.2 Memory Reference and Compensation Signals Table 6-3. Memory Channel B Signals Table 6-4. Memory Reference and Compensation 6.3 Reset and Miscellaneous Signals Table 6-5. Reset and Miscellaneous Signals 6.4 PCI Express*-based Interface Signals 6.5 Intel Flexible Display (Intel FDI) Interface Signals Table 6-6. PCI Express* Graphics Interface Signals Table 6-7. Intel Flexible Display (Intel FDI) Interface 6.6 Direct Media Interface (DMI) Signals 6.7 Phase Lock Loop (PLL) Signals 6.8 Test Access Points (TAP) Signals Table 6-8. Direct Media Interface (DMI) Sign als Processor to PCH Serial Interface Table 6-9. Phase Lock Loop (PLL) Signals Table 6-10. Test Access Points (TAP) Signals 6.9 Error and Thermal Protection Signals Table 6-11. Error and Thermal Protection Signals 6.10 Power Sequencing Signals Table 6-12. Power Sequencing Signals 6.11 Processor Power Signals 6.12 Sense Signals Table 6-13. Processor Power Signals Table 6-14. Sense Signals 6.13 Ground and Non-Critical to Function (NCTF) Signals 6.14 Processor Internal Pull-Up / Pull-Down Resistors Table 6-15. Ground and Non-Critical to Function (NCTF) Signals Table 6-16. Processor Internal Pull-Up / Pull-Down Resistors 7 7.1 Power and Ground Lands 7.2 Decoupling Guidelines 7.2.1 Voltage Rail Decoupling 7.3 Processor Clocking (BCLK[0], BCLK#[0]) 7.3.1 Phase Lock Loop (PLL) Power Supply 7.4 VCC Voltage Identification (VID) Table 7-1. VR 12.0 Voltage Identification Definition (Sheet 1 of 3) Table 7-1. VR 12.0 Volt age Identification Definition (Sheet 2 of 3) Table 7-1. VR 12.0 Voltage Identification Definition (Sheet 3 of 3) 7.5 System Agent (SA) VCC VID 7.6 Reserved or Unused Signals 7.7 Signal Groups Table 7-2. Signal Groups (Sheet 1 of 2) 7.8 Test Access Port (TAP) Connection 7.9 Storage Conditions Specifications 7.10 DC Specifications 7.10.1 Voltage and Current Specifications Page Table 7-5. Processor System Agent I/O Buffer Supply DC Voltage and Current Specifications Table 7-6. Processor Graphics VID based (VAXG) Supply DC Voltage and Current Specifications Table 7-7. DDR3 Signal Group DC Specifications (Sheet 1 of 2) Table 7-7. D DR3 Signal Group DC Specifications (Sheet 2 of 2) Table 7-8. Control Sideband and TAP Signal Group DC Specifications Table 7-9. PCI Express* DC Specifications 7.11 Platform Environmental Control Interface (PECI) DC Specifications 7.11.1 PECI Bus Architecture 7.11.2 DC Characteristics PECI Ground PECI Low Range Maximum V Minimum V Page 8 Information 8.1 Processor Land Assignments Processor Land and Signal Information 94 Datasheet, Volume 1 Figure 8-1. LGA Socket Land Map Page Page Page Page Page Page Page Page Page Page Page Processor Land and Signal Information Page Page 9 DDR Data Swizzling Table 9-1. DDR Data Swizz ling Table Channel A Table 9-1. DDR Data Swizzling Table Channel A Table 9-2. D DR Data Swizzling table Channel B Table 9-2. DDR Data Swizzling table Channel B