Intel DG33BU 2.4 Mechanical Considerations

Technical Reference

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 14

illustrates the mechanical form factor of the board. Dimensions are given in inches

[millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84

millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting

holes are in compliance with the ATX specification.

Figure 14. Board Dimensions

Contents

Main Revision History Revision Revision History Date Preface Intended Audience # What This Document Contains Typographical Conventions Other Common Notation Contents 1 Product Description 2 Technical Reference 3 Overview of BIOS Features 4 Error Messages and Beep Codes 5 Regulatory Compliance and Battery Disposal Information Figures Tables Page 1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Desktop Board DG33BU. Table 1. Feature Summary Table 1. Feature Summary (continued) Page Product Description 13 Table 2. Board Components Shown in Figure 1 Item/callout from Figure 1 Description Page 1.2 Legacy Considerations 1.3 Online Support 1.4 Processor # 1.5 System Memory 1.5.1 Memory Configurations # 1.6 Intel G33 Express Chipset 1.6.1 Intel G33 Graphics Subsystem 1.6.1.1 Intel Graphics Media Accelerator 3100 Graphics Controller 1.6.1.2 Dynamic Video Memory Technology (DVMT) 1.6.1.3 Configuration Modes 1.6.1.4 Advanced Digital Display (ADD2/MEC) Card Support 1.6.2 Intel Viiv Processor Technology 1.6.3 USB 1.6.4 Serial ATA Interfaces 1.6.4.1 Serial ATA Support 1.7 Parallel IDE Controller 1.8 Real-Time Clock Subsystem 1.9 Legacy I/O Controller 1.9.1 Serial Port Interface 1.9.2 Diskette Drive Interface 1.9.3 PS/2 Keyboard and Mouse Interface 1.10 Audio Subsystem 1.10.1 Audio Subsystem Software 1.10.2 Audio Connectors and Headers 1.11 LAN Subsystem 1.11.1 Intel 82566DC Gigabit Ethernet Controller 1.11.2 LAN Subsystem Software 1.11.3 RJ-45 LAN Connector with Integrated LEDs 1.12 Hardware Management Subsystem 1.12.1 Hardware Monitoring and Fan Control 1.12.2 Fan Monitoring 1.12.3 Chassis Intrusion and Detection 1.12.4 Thermal Monitoring 1.13 Power Management 1.13.1 ACPI Product Description 31 1.13.1.1 System States and Power States Global States Sleeping States Processor States Device States 1.13.1.2 ENERGY STAR* 1.13.1.3 Wake-up Devices and Events 1.13.2 Hardware Support CAUTION 1.13.2.1 Power Connector 1.13.2.2 Fan Headers 1.13.2.3 LAN Wake Capabilities CAUTION Page Page 2 Technical Reference What This Chapter Contains 2.1 Memory Map 2.1.1 Addressable Memory Figure 8. Detailed System Memory Address Map Table 9 lists the system memory map. Table 9. System Memory Map 2.2 Connectors and Headers 2.2.1 Back Panel Connectors Page Page 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. Serial ATA Connectors Table 12. Chassis Intrusion Header Table 13. Serial Port Header Table 14. Front and Rear Chassis Fan Headers 2.2.2.2 Add-in Card Connectors 2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header 2.2.2.4 Power Supply Connectors 2.2.2.5 Front Panel Header 2.2.2.6 Auxiliary Front Panel Power LED Header # 2.3 Jumper Block 2.4 Mechanical Considerations 2.4.1 Form Factor 2.5 Electrical Considerations 2.5.1 Power Supply Considerations 2.5.2 Fan Header Current Capability 2.5.3 Add-in Board Considerations 2.6 Thermal Considerations Page 2.7 Reliability 2.8 Environmental 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction 3.2 BIOS Flash Memory Organization 3.3 Resource Configuration 3.3.1 PCI Autoconfiguration 3.3.2 PCI IDE Support 3.4 System Management BIOS (SMBIOS) 3.5 Legacy USB Support 3.6 BIOS Updates 3.6.1 Language Support 3.6.2 Custom Splash Screen 3.7 BIOS Recovery 3.8 Boot Options 3.8.1 CD-ROM Boot 3.8.2 Network Boot 3.8.3 Booting Without Attached Devices 3.8.4 Changing the Default Boot Device During POST 3.9 Adjusting Boot Speed 3.9.1 Peripheral Selection and Configuration 3.9.2 BIOS Boot Optimizations 3.10 BIOS Security Features Page 4 Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker 4.2 BIOS Beep Codes 4.3 BIOS Error Messages 4.4 Port 80h POST Codes Error Messages and Beep Codes 69 Table 37. Port 80h POST Codes continued POST Code Description of POST Operation Table 37. Port 80h POST Codes (continued) Error Messages and Beep Codes 71 Table 37. Port 80h POST Codes (continued) POST Code Description of POST Operation Intel Desktop Board DG33BU Technical Product Specification 72 Table 38. Typical Port 80h POST Sequence POST Code Description 5 Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance 5.1.1 Safety Standards 5.1.2 European Union Declaration of Conformity Statement 5.1.3 Product Ecology Statements 5.1.3.1 Disposal Considerations 5.1.3.2 Recycling Considerations Page 5.1.3.3 Lead Free Desktop Board Intel Desktop Board DG33BU Technical Product Specification 78 Description Mark 5.1.4 EMC Regulations Intel Desktop Board DG33BU Technical Product Specification 80 5.1.5 Product Certification Markings (Board Level) Description Mark 5.2 Battery Disposal Information