Intel DG33BU specifications Reliability, Thermal Considerations for Components

Technical Reference

Table 27 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 27. Thermal Considerations for Components

Component	Maximum Case Temperature
Processor	For processor case temperature, see processor datasheets and
	processor specification updates
Intel 82G33 GMCH	97 oC (under bias)
Intel 82801IH (ICH9DH)	92 oC (under bias)

For information about	Refer to
Processor datasheets and specification updates	Section 1.2, page 15

2.7Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements.

The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG33BU MTBF is 136,977 hours.

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