MAX12557
Dual, 65Msps, 14-Bit, IF/Baseband ADC
2_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VDD = 3.3V, OVDD = 2.0V, GND = 0, REFIN = REFOUT (internal reference), CL≈10pF at digital outputs, VIN = -0.5dBFS (differen-
tial), DIFFCLK/SECLK = OVDD, PD = GND, SHREF = GND, DIV2 = GND, DIV4 = GND, G/T= GND, fCLK = 65MHz, TA= -40°C to
+85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDDto GND ................................................................-0.3V to +3.6V
OVDDto GND............-0.3V to the lower of (V DD + 0.3V) and +3.6V
INAP, INAN to GND...-0.3V to the lower of (VDD + 0.3V) and +3.6V
INBP, INBN to GND...-0.3V to the lower of (VDD + 0.3V) and +3.6V
CLKP, CLKN to
GND........................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFIN, REFOUT
to GND..................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFAP, REFAN,
COMA to GND......-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFBP, REFBN,
COMB to GND......-0.3V to the lower of (VDD + 0.3V) and +3.6V
DIFFCLK/SECLK, G/T, PD, SHREF, DIV2,
DIV4 to GND.........-0.3V to the lower of (VDD + 0.3V) and +3.6V
D0A–D13A, D0B–D13B, DAV,
DORA, DORB to GND..............................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA= +70°C)
68-Pin Thin QFN 10mm x 10mm x 0.8mm
(derate 70mW/°C above +70°C)....................................4000mW
Operating Temperature Range................................-40°C to +85°C
Junction Temperature...........................................................+150°C
Storage Temperature Range.................................-65°C to +150°C
Lead Temperature (soldering 10s).......................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution 14 Bits
Integral Nonlinearity INL fIN = 3MHz
±2.1
LSB
Differential Nonlinearity DNL fIN = 3MHz, no missing codes over
temperature (Note 2)
-1.0 ±0.6 +1.3
LSB
Offset Error
±0.1 ±0.9
%FSR
Gain Error
±0.5 ±5.0
%FSR
ANALOG INPUT (INAP, INAN, INBP, INBN)
Differential Input Voltage Range VDIFF Differential or single-ended inputs
±1.024
V
Common-Mode Input Voltage
VDD / 2
V
Analog Input Resistance RIN Each input, Figure 3 3.4 kΩ
CPAR Fixed capacitance to ground,
each input, Figure 3 2
Analog Input Capacitance
CSAMPLE
Switched capacitance,
each input, Figure 3 4.5
pF
CONVERSION RATE
Maximum Clock Frequency fCLK 65 MHz
Minimum Clock Frequency 5MHz
Data Latency Figure 5 8
Clock
Cycles
DYNAMIC CHARACTERISTICS (differential inputs)
Small-Signal Noise Floor SSNF Input at -35dBFS
74.5
76
dBFS
fIN = 3MHz at -0.5dBFS
72.5
75
fIN = 32.5MHz at -0.5dBFS
74.5
fIN = 70MHz at -0.5dBFS
74.1
Signal-to-Noise Ratio SNR
fIN = 175MHz at -0.5dBFS
70.4 72.5
dB