NXP Semiconductors PBLS4004D 6. Thermal characteristics

PBLS4004D_3 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 03 — 6 January 2009 4 of 15
NXP Semiconductors PBLS4004D
40 V PNP BISS loadswitch
6. Thermal characteristics
[1] Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on a ceramicPCB, Al2O3, standard footprint.
(1) CeramicPCB, Al2O3, standard footprint
(2) FR4PCB, mounting pad for collector 1cm2
(3) FR4PCB, standard footprint
Fig 1. Power derating curves
Tamb (°C)
0 16012040 80
006aaa461
0.4
0.2
0.6
0.8
Ptot
(W)
0
(1)
(2)
(3)
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 312 K/W
[2] - - 236 K/W
[3] - - 210 K/W
Per TR1; PNP low VCEsat transistor
Rth(j-sp) thermal resistance from
junction to solder point - - 105 K/W