Philips Semiconductors |
|
| Product specification | |||
|
|
|
|
|
|
|
MMIC wideband amplifier |
|
|
| BGM1012 | ||
|
|
|
|
|
|
|
LIMITING VALUES |
|
|
|
|
| |
In accordance with the Absolute Maximum Rating System (IEC 60134). |
|
|
|
| ||
|
|
|
|
|
|
|
SYMBOL | PARAMETER | CONDITIONS | MIN. |
| MAX. | UNIT |
|
|
|
|
|
|
|
VS | DC supply voltage | RF input AC coupled | − |
| 4 | V |
IS | supply current |
| − |
| 50 | mA |
Ptot | total power dissipation | Ts ≤ 90 °C | − |
| 200 | mW |
Tstg | storage temperature |
| −65 |
| +150 | °C |
Tj | operating junction temperature |
| − |
| 150 | °C |
PD | maximum drive power |
| − |
| 10 | dBm |
THERMAL CHARACTERISTICS |
|
|
|
|
| |
|
|
|
|
|
|
|
SYMBOL | PARAMETER | CONDITIONS |
|
| VALUE | UNIT |
|
|
|
|
|
|
|
Rth | thermal resistance from junction to | Ptot = 200 mW; Ts ≤ 90 °C |
|
| 300 | K/W |
| solder point |
|
|
|
|
|
|
|
|
|
|
|
|
2002 Sep 06 | 3 |
