Philips BGM1012 specifications Package Outline, Plastic surface mounted package; 6 leads, SOT363

Philips Semiconductors	Product specification
MMIC wideband amplifier	BGM1012
PACKAGE OUTLINE
Plastic surface mounted package; 6 leads	SOT363

D B

y

E A X

HE v M A

6

5 4

pin 1 index

1

e1

e

2	3
bp	w M

0

B

Q

A

A1

c

Lp

detail X

1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT	A	A1	bp	c	D	E	e	e1	HE	Lp	Q	v	w	y
		max
mm	1.1	0.1	0.30	0.25	2.2	1.35	1.3	0.65	2.2	0.45	0.25	0.2	0.2	0.1
	0.8		0.20	0.10	1.8	1.15			2.0	0.15	0.15

OUTLINE VERSION

REFERENCES

IEC JEDEC EIAJ

EUROPEAN

PROJECTION

ISSUE DATE

SOT363

SC-88

97-02-28

2002 Sep 06 10