Philips TDA5051A

1999 May 31 12

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Table 3 Relationship between DATAIN and TXOUT

Note

1. X = don’t care.

PD DATAIN TXOUT

(1) high-impedance

0 1 high-impedance (after th)

0 0 active with DC offset

handbook, full pagewidth

MGK837

tW(burst)

tsu

VO(DC)

tW(burst)(min)

TXOUT

tW(DI)

tW(DI)(min)

DATAIN

(1) (2) (3)

Fig.8 Relationship between DATAIN and TXOUT (see Table 3).

(1) tW(DI)>t

W(DI)(min).

(2) tW(DI)(min)=t

su+

(3) tW(DI)(min)<t

su; wrong operation.

fcr

-----

Fig.9 Pulse shape characteristics.

handbook, halfpage

MGK010

tW(burst)

tsu th

100%

Contents

Main Page 1999 May 31 3 ORDERING INFORMATION Fig.1 Block diagram. BLOCK DIAGRAM Page Home automation modem TDA5051A Page Page Page 1999 May 31 9 Fig.4 Shaped signal spectrum. Fig.5 AGC time constant definition (not to scale). 1999 May 31 10 TIMING Conguration for clock TDA5051A Fig.7 Typical configuration for on-chip clock circuit. Fig.6 External clock. Page Page 1999 May 31 13 Timing diagrams Fig.11 Timing diagram during power-up in reception mode. Fig.10 Timing diagram during power-up in transmission mode. 1999 May 31 14 Fig.12 Power-down sequence in transmission mode. Fig.14 Power saving by dynamic control of power-down. Fig.13 Power-down sequence in reception mode. 1999 May 31 15 TEST INFORMATION Fig.15 Test set-up for measuring demodulation delay. 1999 May 31 16 Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal. 1999 May 31 17 TDA5051A Fig.17 Test set-up for measuring Bit Error Rate (BER). 1999 May 31 18 APPLICATION INFORMATION Fig.18 Application diagram without power line insulation. 1999 May 31 19 1999 May 31 20 Fig.21 Application diagram with power line insulation. 1999 May 31 21 Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBV typ.). 1999 May 31 22 Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBV typ.). 1999 May 31 23 PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a worldwide company Printed in The Netherlands