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Philips TDA5051A 1999 May 31 21, Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBV typ.).

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1999 May 31 21

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBµV typ.).

fcr= 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

handbook, full pagewidth

MGK843

250 V (AC)

max T 630 mA

1 mH

68 Ω

(2 W)

47 nF/X2

250 V (AC)

47 µH

low RS

MOV

250 V (AC)

47 nF

(63 V)

47 µH

100 µF

(16 V)

470 µF

(16 V)

7V5

(1.3 W) 1N4006

1N4006

2 µF

250 V (AC)

10 nF

VDDD VDDAP

APGND AGNDDGND

VDDA

RXIN

TXOUT

1 µF

(16 V)

+5 V

MICRO-

CONTROLLER

OSC1

XTAL

7.3728 MHz

2.2 MΩ

OSC2

85912

1311

47 nF

78L05

27 pF27 pF

DATAIN

DATAOUT

CLKOUT TDA5051A

SA5.0A

1 kΩ33

kΩ

150

kΩ

10 nF

BC547B

Contents

Main Page 1999 May 31 3 ORDERING INFORMATION Fig.1 Block diagram. BLOCK DIAGRAM Page Home automation modem TDA5051A Page Page Page 1999 May 31 9 Fig.4 Shaped signal spectrum. Fig.5 AGC time constant definition (not to scale). 1999 May 31 10 TIMING Conguration for clock TDA5051A Fig.7 Typical configuration for on-chip clock circuit. Fig.6 External clock. Page Page 1999 May 31 13 Timing diagrams Fig.11 Timing diagram during power-up in reception mode. Fig.10 Timing diagram during power-up in transmission mode. 1999 May 31 14 Fig.12 Power-down sequence in transmission mode. Fig.14 Power saving by dynamic control of power-down. Fig.13 Power-down sequence in reception mode. 1999 May 31 15 TEST INFORMATION Fig.15 Test set-up for measuring demodulation delay. 1999 May 31 16 Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal. 1999 May 31 17 TDA5051A Fig.17 Test set-up for measuring Bit Error Rate (BER). 1999 May 31 18 APPLICATION INFORMATION Fig.18 Application diagram without power line insulation. 1999 May 31 19 1999 May 31 20 Fig.21 Application diagram with power line insulation. 1999 May 31 21 Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBV typ.). 1999 May 31 22 Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBV typ.). 1999 May 31 23 PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a worldwide company Printed in The Netherlands