Philips TDA5051A

1999 May 31 3

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

ORDERING INFORMATION

BLOCK DIAGRAM

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA5051AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

Fig.1 Block diagram.

handbook, full pagewidth

MGK832

DGND

AGND

VDDA VDDAP

TXOUT

RXIN

APGND

VDDD

311

ROM

DAC clock

filter clock

OSCILLATOR

DATAOUT

OSC2

OSC1

DIGITAL

DEMODULATOR

DIGITAL

BAND-PASS

FILTER

÷2

CONTROL LOGIC

D/A

modulated

carrier

TDA5051A

A/D

TEST1 SCANTEST

U/D

COUNT

PEAK

DETECT

POWER

DRIVE

WITH

PROTECTION

DATAIN

CLKOUT

Contents

Main Page 1999 May 31 3 ORDERING INFORMATION Fig.1 Block diagram. BLOCK DIAGRAM Page Home automation modem TDA5051A Page Page Page 1999 May 31 9 Fig.4 Shaped signal spectrum. Fig.5 AGC time constant definition (not to scale). 1999 May 31 10 TIMING Conguration for clock TDA5051A Fig.7 Typical configuration for on-chip clock circuit. Fig.6 External clock. Page Page 1999 May 31 13 Timing diagrams Fig.11 Timing diagram during power-up in reception mode. Fig.10 Timing diagram during power-up in transmission mode. 1999 May 31 14 Fig.12 Power-down sequence in transmission mode. Fig.14 Power saving by dynamic control of power-down. Fig.13 Power-down sequence in reception mode. 1999 May 31 15 TEST INFORMATION Fig.15 Test set-up for measuring demodulation delay. 1999 May 31 16 Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal. 1999 May 31 17 TDA5051A Fig.17 Test set-up for measuring Bit Error Rate (BER). 1999 May 31 18 APPLICATION INFORMATION Fig.18 Application diagram without power line insulation. 1999 May 31 19 1999 May 31 20 Fig.21 Application diagram with power line insulation. 1999 May 31 21 Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBV typ.). 1999 May 31 22 Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBV typ.). 1999 May 31 23 PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 Data Handbook IC26; Integrated Circuit Packages Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods Page Page Philips Semiconductors a worldwide company Printed in The Netherlands