Philips TDA8950 14. Package outline

TDA8950_1 © NXP B.V. 2008. All rights reserved.
Preliminary data sheet Rev. 01 — 9 September 2008 33 of 39
NXP Semiconductors TDA8950
2× 150 W class-D power amplifier
14. Package outline
Fig 29. Package outline SOT411-1 (DBS23P)
UNIT A2
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 4.6
4.3
A4
1.15
0.85
A5
1.65
1.35
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT411-1 98-02-20
02-04-24
0 5 10 mm
scale
D
L
L1
L2
E2
E
c
A4
A5
A2
m
L3
E1
Q
wM
bp
1
d
Ze2
e
e
123
j
DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) SOT411-1
vM
D
xh
Eh
non-concave
view B: mounting base side
B
β
e1 bpcD
(1) E(1) Z(1)
deDhLL
3m
0.75
0.60 0.55 0.35 30.4 29.9 28.0 27.5 12 2.54
12.2
11.8 10.15 9.85
1.27
e2
5.08 2.4
1.6
Eh
6
E1
14
13
L1
10.7
9.9
L2
6.2
5.8
E2
1.43
0.78
2.1
1.8
1.85
1.65 4.3
3.6
2.8
Qj
0.25
w
0.6
v
0.03
x
45°
β