Philips TDA8950 HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3

TDA8950_1 © NXP B.V. 2008. All rights reserved.
Preliminary data sheet Rev. 01 — 9 September 2008 34 of 39
NXP Semiconductors TDA8950
2× 150 W class-D power amplifier
Fig 30. Package outline SOT566-3 (HSOP24)
UNIT A4(1)
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
03-02-18
03-07-23
IEC JEDEC JEITA
mm +0.08
−0.04
3.5 0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT566-3
0 5 10 mm
scale
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3
A
max.
detail X
A2
3.5
3.2
D2
1.1
0.9
HE
14.5
13.9
Lp
1.1
0.8
Q
1.7
1.5 2.7 2.2
v
0.25
w
0.25
yZ
8°
0°
θ
0.07
x
0.03
D1
13.0
12.6
E1
6.2
5.8
E2
2.9
2.5
bpc
0.32
0.23
e
1
D(2)
16.0
15.8
E(2)
11.1
10.9
0.53
0.40
A3
A4
A2(A3)
Lp
θ
A
Q
D
y
x
HE
E
c
vMA
X
A
bpwM
Z
D1D2
E2
E1
e
24 13
112
pin 1 index