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Philips TDA9964 Fig 5. DAC voltage output as a function of DAC input code., Fig 6. Line frequency timing diagram.

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Philips Semiconductors TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Objective speciﬁcation Rev. 03 — 16 January 2001 11 of 23

Fig 5. DAC voltage output as a function of DAC input code.

FCE519

OFDOUT

DAC voltage

output

(V)

1.0

0255

OFDOUT control DAC input code

Fig 6. Line frequency timing diagram.

FCE520

BLK

(active HIGH)

CLPOB

(active HIGH)

CLPDM

(active HIGH)

AGCOUT VIDEO OPTICAL BLACK

CLPOB

WINDOW

HORIZONTAL FLYBACK DUMMY VIDEO

BLK window

CLPDM

WINDOW

Contents

Main TDA9964 12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras Rev. 03 16 January 2001 Objective specication 1. Description 2. Features 4. Quick reference data 5. Ordering information 12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras Objective specication Rev. 03 16 January 2001 3 of 23 hhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhhh 6. Block diagram Fig 1. Block diagram. TDA9964 Philips Semiconductors TDA9964 7. Pinning information Fig 2. Pin conguration. 7.2 Pin description 7.1 Pinning TDA9964HL Page Philips Semiconductors TDA9964 8. Limiting values 9. Thermal characteristics 10. Characteristics In accordance with the Absolute Maximum Rating System (IEC 60134). = 3.0V; V = 2.7V; f = 3.0 V; V = 2.7 V; f = 30 MHz; T = 3.0 V; V = 2.7 V; f = 30 MHz; T Philips Semiconductors TDA9964 Fig 3. Pixel frequency timing diagram; all polarities active HIGH. Fig 4. Pixel frequency timing diagram; all polarities active LOW. Fig 5. DAC voltage output as a function of DAC input code. Fig 6. Line frequency timing diagram. 12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras Fig 7. Total gain from CDS input to ADC input as a function of PGA input code. Fig 8. Typical total noise performance as a function of PGA gain. Fig 9. Serial interface block diagram. VSYNC Fig 10. Loading sequence of control input data via the serial interface. tsu1=t Page 11. Application information D1 D0 TDA9964 Fig 11. Application diagram. 11.1 Power and grounding recommendations 12. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 Fig 12. SOT313-2. 13. Handling information 14. Soldering 14.1 Introduction to soldering surface mount packages Data Handbook IC26; Integrated Circuit Packages 14.2 Reow soldering 15. Revision history 16. Data sheet status 17. Denitions 18. Disclaimers Philips Semiconductors - a worldwide company Internet: http://www.semiconductors.philips.com Contents