Philips Semiconductors TDA9964
12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras
Objective specification Rev. 03 — 16 January 2001 19 of 23
9397 750 07918 © Philips Electronics N.V. 2001. All rights reserved.
The footprint must incorporate solder thieves at the downstream end.
•For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4seconds at 250 °C. Amildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to5 seconds between 270 and320 °C.
14.5 Package related soldering information
[1] Allsurface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximumtemperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
DataHandbook IC26; Integrated
Circuit Packages; Section: Packing Methods
.
[2] Thesepackages are not suitable forwave soldering as a solder joint between the printed-circuit board
andheatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
[3] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. Thepackage footprint must incorporate solder thieves downstream and at the side corners.
[4] Wavesoldering is only suitable for LQFP,QFP and TQFP packages with a pitch (e) equal to or larger
than0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[5] Wavesolderingis only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm.
Table 13: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package Soldering method
Wave Reflow[1]
BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS not suitable[2] suitable
PLCC[3], SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended[3][4] suitable
SSOP, TSSOP, VSO not recommended [5] suitable