38, PRINTED WIRING BOARD – BD Board

6-4. PRINTED WIRING BOARD – BD Board –

•See page 36 for Circuit Boards Location.

•Semiconductor Location

Ref. No.	Location

D101	A-1
D181	D-3
D183	D-3
IC103	B-1
IC123	D-2
IC171	D-1
Q102	B-1
Q103	C-1
Q104	B-1

MDS-JE530

S102

REFLECT DET,

PROTECT DET

LOW REFLECT RATE/

UNPROTECT

(SLIDE)

HIGH REFLECT RATE/

WRITE PROTECT

(SPINDLE)

RED	BLK

(Page 45)

•Semiconductor Location

Ref. No.	Location

IC101	A-3
IC121	C-3
IC124	C-3
IC152	B-1
IC181	C-1
IC192	D-1
Q101	B-3
Q162	B-3
Q163	B-3
Q181	C-1
Q182	C-2

– 37 –

– 38 –

Page 35

Image 35

Sony MDS-JE530 38, PRINTED WIRING BOARD – BD Board, •See page 36 for Circuit Boards Location, •Semiconductor Location

Contents

MDS-JE530 SPECIFICATIONSSERVICE MANUAL Supplied accessories – 2 – SELF-DIAGNOSISFUNCTION Selecting the Test Mode Items of Error History Mode Items and ContentsTable of Error Codes – 3 – ELECTRICAL ADJUSTMENTS TABLE OF CONTENTS6.DIAGRAMS DISASSEMBLY ADVARSEL Flexible Circuit Board RepairingNotes on chip component replacement – 5 – JIG FOR CHECKING BD BOARD WAVEFORM – 6 – Display Precedure – 7 –Record Precedure – 8 – CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS Fig. 1 Reading the Test Mode Display – 9 –RETRY CAUSE DISPLAY MODE Precedure Reading the Display – 10 –Hexadecimal nBinary Conversion Table This section is extracted from instruction manual SECTION GENERAL– 11 – LOCATION OF CONTROLSPage FRONT PANEL SECTION SECTION DISASSEMBLY– 13 – CASE MECHANISM DECK SECTTION MDM-5D – 14 –MAIN BOARD BASE UNIT MBU-5D,BD BOARD – 15 –SLIDER CAM SW BOARD, LOADING MOTOR M103 – 16 – – 17 – 1. PRECAUTIONS FOR USE OF TEST MODE2. SETTING THE TEST MODE SECTION TEST MODE 5. SELECTING THE TEST MODE – 18 – 5-3. Non-VolatileMemory Mode EEP MODE – 19 –5-1.Operating the Continuous Playback Mode 7. TEST MODE DISPLAYS – 20 –6. FUNCTIONS OF OTHER BUTTONS MEANINGS OF OTHER DISPLAYS – 21 – – 22 – SECTION ELECTRICAL ADJUSTMENTS1.PARTS REPLACEMENT AND ADJUSTMENT – 23 – 2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION4. PRECAUTIONS FOR ADJUSTMENTS Laser power meter – 24 – Checking Procedure6-2.Laser Power Check Specification 6-4.Focus Bias Check 6-5.C PLAY Checking MO Error Rate CheckCD Error Rate Check – 25 – Setting Procedure 7. INITIAL SETTING OF ADJUSTMENT VALUE9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT 10. LASER POWER ADJUSTMENT Adjusting Procedure 11. TRAVERSE ADJUSTMENT– 27 – Specification Adjusting Procedure 12.FOCUS BIAS ADJUSTMENT– 28 – 13-2.MO Error Rate Check 13.ERROR RATE CHECK15.AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13-1.CD Error Rate Check – BD BOARDSide B – Adjustment Location– 30 – – BD BOARDSide A – – 32 – MDS-JE530 SECTION DIAGRAMS6-1.BLOCK DIAGRAM – MD SERVO Section – – 31 – – 34 – 6-2.BLOCK DIAGRAM – MAIN Section –MDS-JE530 – 33 – Note on Schematic Diagram – 35 –Note on Printed Wiring Board • Circuit Boards Location – 36 – •Semiconductor Location 6-4.PRINTED WIRING BOARD – BD Board –– 38 – •See page 36 for Circuit Boards Location MDS-JE530 – 39 –– 40 – MDS-JE530 6-6.SCHEMATIC DIAGRAM – BD Board 2/2 – See•– 41 – – 42 – – 44 – 6-7.SCHEMATIC DIAGRAM – SW Board –6-8.PRINTED WIRING BOARD – SW Board – – 43 – page 36 for Circuit Boards Location 6-9.PRINTED WIRING BOARD – MAIN Board – See•– 45 – – 46 – Page Page 41 Page – 47 –– 48 – MDS-JE530 MDS-JE530 – 49 –– 50 – • Semiconductor Location – 51 –– 52 – MDS-JE530 Page 47 Page – 53 –– 54 – MDS-JE530 IC101 •IC Block Diagrams – BD Board –– 55 – – 56 – IC431 – 57 –IC310 M5293L 6-14.IC PIN FUNCTION DESCRIPTION – 58 – •BD BOARD IC121 CXD2656R – 59 – – 60 – – 61 – •MAIN BOARD IC501 M30624MG-207FPSYSTEM CONTROLLER – 62 – – 63 – – 64 – 1CHASSIS SECTION SECTION EXPLODED VIEWS– 65 – 59 54 52 2FRONT PANEL SECTION 61 64 61 63 6166 61 61 51 53 223 207 – 67 –3MECHANISM SECTION MDM-5D 213 207 202 201 254 253 – 68 –4BASE UNIT SECTION MBU-5D 252 263 270 – 69 – SECTION ELECTRICAL PARTS LIST – 70 – DISPLAY DISPLAY KEY SW– 71 – KEY SW MAIN– 72 – MAIN – 73 – MAIN – 74 – MAIN POWER SW– 75 – 9-928-824-11 MDS-JE530– 76 – Sony Corporation